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Method for manufacturing integrated LED chip light source

A technology of an LED chip and a manufacturing method, which is applied to the manufacturing field of an integrated LED chip light source, can solve the problems of high cost, complex process and low production efficiency, and achieve the effects of low cost, simple process and high production efficiency

Inactive Publication Date: 2009-09-16
NANKER GUANGZHOU SEMICON MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This light source manufacturing method of integrated LED chips needs to first package the LED bare chip first, and then perform secondary packaging on the aluminum substrate with circuit, so the process is complicated, the cost is high, and the production efficiency is low.

Method used

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  • Method for manufacturing integrated LED chip light source
  • Method for manufacturing integrated LED chip light source
  • Method for manufacturing integrated LED chip light source

Examples

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Embodiment Construction

[0022] Such as Figure 1 ~ Figure 3 As shown, the light source of the integrated LED chip of this embodiment is a light source of a 220V alternating current high bay lamp, including an LED bare chip 1 and an aluminum substrate 2. The LED bare chip 1 includes a substrate 10 and an N-type epitaxial layer 11. , P-type epitaxial layer 12, the front surface of the aluminum substrate 2 has a thermally conductive insulating layer 3, the thermally conductive insulating layer 3 has a printed circuit 6 on it, the LED bare chip 1 is a two-electrode chip, and the substrate 10 is Alumina (Sapphire, Al 2 O 3 ) The substrate, of course, the substrate 10 may also be a substrate made of other materials such as gallium arsenide (GaAs) or silicon carbide (SiC). The P-type epitaxial layer 12 and the N-type epitaxial layer 11 pass through two Two metal wires 43, 45 are soldered on the two adjacent printed circuits 6 to realize the formal mounting of the LED chips. The LED bare chips 1 are divided into ...

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Abstract

The invention discloses a method for manufacturing an integrated LED chip light source, which has low cost, simple process and high production efficiency. Light sources manufactured by the method have good light source radiating effect. The method comprises the following steps: (a) forming a circuit on an aluminum substrate, namely forming a preset printed circuit on the aluminum substrate with a heat-conducting insulating layer according to the series-parallel connection relation of LED bare chips, wherein except welding points, chips and routing positions on the printed circuit, conducting wires of the other parts are covered with an anti-welding layer; (b) packaging the LED bare chips, namely packaging a plurality of the LED bare chips normally or inversely and connect the same to the printed circuit of the aluminum substrate; and (c) forming a protection layer, namely covering silica gel or resin on the LED bare chips and corresponding peripheral positions thereof as protection layers which cover the LED bare chips and packaging metal wires or solder balls. The method can be widely applied in the field of LED light sources.

Description

Technical field [0001] The invention relates to a method for manufacturing an integrated LED chip light source. Background technique [0002] Formal chip technology is a traditional microelectronic packaging technology with mature technology and a wide range of applications. At present, most of the LEDs are full-mounted LEDs. Whether the substrate of the LED bare chip is gallium arsenide or silicon carbide, a metal layer is plated on the outside of the substrate as an N-type electrode, and it also serves as a heat sink. A support with a reflector cup is used as the cathode, and the P-type epitaxial layer on the top is welded to the anode lead through a metal wire. Since the top of the bare chip and the substrate surface are each one end of the electrode, it is traditionally called "single Electrode chips. At present, yellow and red LEDs mostly use such single-electrode chips. In addition to the single-electrode LED bare chip (one electrode on the front and back of the chip), the ...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V19/00F21V23/00F21V23/06H01L33/00F21Y101/02F21K9/90F21Y115/10
Inventor 吴俊纬
Owner NANKER GUANGZHOU SEMICON MFG
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