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Resin composition for printed circuit board, dry film and printed circuit board

A technology for printed circuit boards and resin compositions, applied in the secondary treatment of printed circuits, synthetic resin layered products, coatings, etc., can solve the problems of reducing recycling, hindering, and reducing the molecular weight of PET, and achieve the effect of improving characteristics

Active Publication Date: 2012-04-25
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the recycling process, there is a problem that the molecular weight of PET decreases due to the hydrolysis of the ester bond, and the melt viscosity and mechanical strength of PET also decrease.
Then, such a decrease in quality becomes a cause of hindering the recycling of PET bottles.

Method used

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  • Resin composition for printed circuit board, dry film and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0156] The resin composition of Example 1: The resin composition of Example 1 was applied to each substrate with a film thickness of 20 μm using a PET 150-mesh screen, and heated at 150° C. for 30 minutes in a hot air circulation drying oven. It heats and heat-cures, and produces a test piece.

Embodiment 2

[0157] Resin composition of Example 2: The resin composition of Example 2 was coated on each substrate using a PET225 mesh screen to have a film thickness of 15 μm, conveyed at a conveyor speed of 4 m / min, and cooled by air. A 80W / cm, 3-lamp type high-pressure mercury lamp was used to irradiate ultraviolet rays to prepare test pieces.

[0158] Resin compositions of Examples 3 and 4: The resin compositions of Examples 3 and 4 were coated on each substrate using a PET 100-mesh screen to a film thickness of 20 μm, and passed through a hot air circulation drying oven at 80° C. Allow to dry for 30 minutes to form a non-sticky film. Expose the substrate according to the prescribed pattern through the negative film, with a spray pressure of 2kg / cm 2 1wt% Na 2 CO 3 The aqueous solution is developed to form a resist pattern. This board|substrate was heated at 150 degreeC for 60 minutes, it was thermally cured, and the test piece was produced.

[0159] performance evaluation

[01...

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Abstract

The invention provides a resin composition for printed circuit concerning environment while maintaining enhancement characteristic of resin composition for printed circuit, a dry film and a printed circuit board using the same. The resin composition for printed circuit includes regenerated polyethylene glycol terephthalate.

Description

technical field [0001] The present invention relates to a resin composition for a printed wiring board, a dry film using the same, and a printed wiring board that are excellent in environmental considerations, insulation, and heat resistance. Background technique [0002] In recent years, from the viewpoint of environmental issues, the use of environmentally friendly materials has also been required for printed circuit boards used in electronic equipment. For example, due to the social problem of generating harmful gases such as dioxins during combustion, flame-retardant materials or coloring materials used for prepregs and solder resists are also required to change from existing halogen-containing systems such as bromine to non-halogen systems. convert. [0003] For example, various studies have been made on the non-halogenation of the flame retardant material of the composition for printed wiring boards (for example, refer patent document 1 etc.). However, due to increas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027B32B27/36H05K3/28
CPCC08G63/183C08L67/03C08L2207/20C09D167/03H05K3/28
Inventor 椎名桃子有马圣夫
Owner TAIYO HLDG CO LTD