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Braze-welding cubic boron nitride high-temperature copper-based active solder and preparing method thereof

A cubic boron nitride and active solder technology, applied in welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problems of high temperature performance thermal stability mismatch, low working temperature, unsatisfactory, etc. Low cost, high working temperature and good mechanical properties

Inactive Publication Date: 2009-10-07
JILIN UNIV
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Problems solved by technology

The preparation of c-BN tools and products by silver-based solder brazing has high cost and low working temperature. The high-temperature performance of products and tools does not match the thermal stability of c-BN, which cannot meet the requirements of c-BN as a high-temperature wear-resistant material.

Method used

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  • Braze-welding cubic boron nitride high-temperature copper-based active solder and preparing method thereof

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Embodiment Construction

[0012] The method of the present invention will be further described in detail through the examples given below.

[0013] In the invention, Cu, Ni, Zr, and Ti metals with a particle size of 180-200 μm and a purity of 99.99% are combined according to an optimized test ratio, and are uniformly mixed and smelted in a high vacuum brazing furnace. During vacuum melting, the degree of vacuum, melting temperature and holding time all have an important influence on the connection quality of Cu-Ni-Zr-Ti brazing c-BN products and tools. The active elements are easily oxidized and cannot react with c-BN after oxidation. In order to prevent the oxidation of active elements, during the smelting process of high temperature copper-based active solder, the vacuum value should be less than 2.9×10 -3 Pa. The smelting temperature should be controlled at 1050-1150℃, and the holding time should be 10 minutes to ensure that the active elements have sufficient thermodynamic activity. In order to make th...

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Abstract

The present invention relates to a braze-welding cubic boron nitride high-temperature copper-based active solder and preparing method thereof. The Cu is used as the basic alloy component. The elements of Ni, Zr and Ti are added for forming the high-temperature copper-based active solder. The high-temperature copper-based active solder comprises the following components by weight: 90-79.5 parts of Cu, 4-5 parts of Ni, 1-5.5 parts of Zr, and 5-10 parts of Ti. The preparing method of solder comprises the following steps: adopting the metals of Cu, Ni, Zr and Ti with the particle size of 180-200 mu m and purity of 99.99% for mixing with an optimized experiment ratio of: 90-79.5 parts of Cu, 4-5 parts of Ni, 1-5.5 parts of Zr, and 5-10 parts of Ti; after mixing to uniform, placing into a high-vacuum brazier for smelting with the following conditions: less than 2.9*10 of vacuum degree, 1050-1150 DEG C of smelting temperature; and keeping the temperature for about 10 minutes. Thereby a high-temperature copper-based active solder which has the advantages of higher melting point, excellent combination property and low cost.

Description

Technical field [0001] The invention relates to a brazing cubic boron nitride high-temperature copper-based active solder and a preparation method thereof, belonging to the field of metal materials. Background technique [0002] The hardness of Cubic Boron Nitride (c-BN) is second only to diamond, and it has excellent physical, chemical, mechanical and thermal stability. It will not be oxidized when heated to 1000℃ in the atmosphere, especially non-existent. Due to the limitation of the reaction of diamond products and tool processing black iron-based alloy materials, it has become a new generation of superhard materials and has been used as an alternative material for diamond by the international material community. c-BN products and tools are very suitable for processing black iron-based alloy materials, such as hardened steel, high-speed tool steel, bearing steel, stainless steel, heat-resistant steel, titanium alloy and other high hardness and toughness metal materials. Espec...

Claims

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Application Information

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IPC IPC(8): B23K35/30C22C1/02
Inventor 邱小明王毅殷世强
Owner JILIN UNIV
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