Polishing liquid composition
A technology of composition and polishing liquid, which is applied in the direction of polishing composition containing abrasive, zirconium compound, grinding device, etc., can solve the problems of not being able to reduce scratches, not being able to fully ensure the grinding speed, etc.
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Embodiment approach 1
[0033] An example of the polishing liquid composition of the present invention will be described using Embodiment 1.
[0034] The composite oxide particles constituting the polishing liquid composition according to Embodiment 1 are represented by, for example, the following composition formula.
[0035] Ce x Zr 1-x o 2
[0036] Wherein, x satisfies the conditional formula 0
[0037] In the composite oxide particles, ceria and zirconia are uniformly fused to form a solid phase, and the spectrum obtained by analyzing the composite oxide particles by X-ray (Cu-Kα1 ray, λ=0.154050nm) diffraction method , the following peaks were observed.
[0038] That is, in this spectrum, at least: a peak (the first peak) whose apex is within the range of 28.61 to 29.67° at the diffraction angle 2θ, and a peak (the seco...
Embodiment approach 2
[0130] Another example of the polishing liquid composition of the present invention is described in Embodiment 2.
[0131] The polishing liquid composition of the present embodiment contains, in addition to the aforementioned composite oxide particles, a water-soluble organic compound that contributes to the formation of a polishing surface having a high surface flatness.
[0132] In the polishing liquid composition of this embodiment, by containing water-soluble organic compound as additive, can form the high polishing surface of planarity, and, by using the composite oxide particle that does not have in the past containing cerium and zirconium as abrasive grain, Grinding speed can be increased.
[0133] The reason for this is presumed as follows. The composite oxide particles containing cerium and zirconium contained in the polishing liquid composition of the present embodiment can be used as abrasive grains capable of polishing objects to be polished at high speed, as will...
Embodiment
[0211]
[0212] 1. Base material of aluminosilicate glass substrate for hard disk
[0213] A substrate made of an aluminosilicate glass substrate for hard disks (hereinafter simply referred to as "glass substrate") was prepared. The glass substrate was ground in advance with a polishing liquid composition containing cerium oxide particles as a polishing agent. The surface roughness was 0.3 nm (AFM-Ra), the thickness was 0.635 mm, the outer diameter was 65 mm, and the inner diameter was 20 mm.
[0214] 2. Synthetic quartz wafer
[0215] A synthetic quartz wafer (manufactured by Optostar Co., Ltd.) having a diameter of 5.08 cm (2 inches) and a thickness of 1.0 mm was prepared by grinding both main surfaces.
[0216] 3. Silicon wafer with TEOS (tetraethoxysilane) film
[0217] A TEOS film having a thickness of 2000 nm formed on a silicon wafer having a diameter of 20.32 cm (8 inches) by a parallel plate type plasma chemical vapor deposition method (p-CVD method) was prepared....
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Abstract
Description
Claims
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