Laser dicing sheet and method for manufacturing chip body

A technology of laser cutting and matrix, which is applied in the direction of film/sheet adhesive, semiconductor/solid device manufacturing, manufacturing tools, etc. It can solve the problems that the cutting sheet cannot be realized, and there is no use of laser cutting sheet, so as to improve the shape restorative effect

Active Publication Date: 2009-10-28
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this state, the sagging cutting piece comes into contact with other ring frames or cutting pieces collected in the collection box, so the collection box cannot smoothly collect it therein.
[0011] [0010] As a result, the cutting sheet of the film described in Patent Document 3 cannot be realized, and it is not used as a laser cutting sheet after all.

Method used

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  • Laser dicing sheet and method for manufacturing chip body
  • Laser dicing sheet and method for manufacturing chip body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0160] Prepare 2-hydroxyethyl acrylate (2HEA), 4,4'-dicyclohexylmethane isocyanate (H 12 MDI) and polyester polyol (Polyol: molecular weight 826) represented by the following formula, molar ratio 2HEA:H 12 MDI:Polyol=2:4:3. H 12 MDI is reacted with polyester polyol, and 2HEA is added to the resulting reaction product to obtain a urethane acrylate oligomer.

[0161] (chemical 1)

[0162]

[0163] [0086] Next, 50 parts by weight of urethane acrylate oligomer, 50 parts by weight of energy ray curable monomer (isobornyl acrylate), and 3 parts by weight of photoinitiator (Chiba Specialty Chemicals) Co., Ltd. 184) was mixed to obtain a coating liquid for coating film formation.

[0164] [0087] By means of a spray die (fountain die) method, the above-mentioned coating solution is coated with a thickness of 100 μm on a polyethylene terephthalate (PET) film (manufactured by Lintec Co., Ltd.) that has undergone a silicone release treatment. On SP-PET3801), a resin composition la...

Embodiment 2

[0170] Prepare 2-hydroxyethyl acrylate (2HEA), isophorone diisocyanate (IPDI) and polytetramethylene glycol (PTMG: weight average molecular weight 2000), molar ratio 2HEA:IPDI:PTMG=2:5: 4. Initially, IPDI and PTMG were reacted, and 2HEA was added to the resulting reaction product to obtain a urethane acrylate oligomer.

[0171] [0093] Next, 50 parts by weight of urethane acrylate oligomer, 50 parts by weight of energy ray curable monomer (isobornyl acrylate), 0.5 part by weight of photoinitiator (Chiba Specialty Chemical Co., Ltd. Dalokyua 1173) manufactured in 2010 was mixed to obtain a coating liquid for coating film formation.

[0172] [0094] Thereafter, a substrate film was produced in the same manner as in Example 1 using the obtained coating solution, and an adhesive layer was provided in the same manner to obtain a laser-cut sheet. The results are shown in Table 1.

Embodiment 3

[0174] Prepare 2-hydroxyethyl acrylate (2HEA), isophorone diisocyanate (IPDI) and polypropylene glycol (PPG: weight average molecular weight 2000), with a molar ratio of 2HEA:IPDI:PPG=2:5:4. First, IPDI and PPG were reacted, 2HEA was added to the resulting reaction product, and a urethane acrylate oligomer was obtained.

[0175] [0096] Next, 50 parts by weight of urethane acrylate oligomer, 50 parts by weight of energy ray curable monomer (isobornyl acrylate), 0.5 part by weight of photoinitiator (Chiba Specialty Chemical Co., Ltd. Darokiyua 1173) produced in 2010 was mixed to obtain a coating solution for coating film formation.

[0176] [0097] Afterwards, a substrate film was produced in the same manner as in Example 1 using the obtained coating solution, and an adhesive layer was similarly provided to obtain a laser-cut sheet. The results are shown in Table 1.

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Abstract

The present invention aims to prevent cutting of a dicing sheet, damage to a chuck table and fusion bonding of a dicing sheet to a chuck table by laser light during laser dicing. Specifically disclosed is a laser dicing sheet which is characterized by being composed of a base made of a polyurethane acrylate and an adhesive layer formed on one side of the base.

Description

[0001] technology area [0002] [0001] The present invention relates to a laser dicing sheet suitable for the purpose of fixing a workpiece when dicing a workpiece with a laser to form a chip, and a method for manufacturing a chip body appropriately using the laser dicing sheet. Background technique [0003] [0002] Laser cutting can sometimes cut workpieces that are difficult to cut with blade cutting methods, and has attracted attention in recent years. The present applicant has disclosed an example of a laser-cut sheet used for such laser cutting (Patent Document 1). [0004] [0003] In laser cutting, the workpiece is diced by scanning the laser light on the workpiece fixed on the cutting sheet. At this time, the focal point of the laser light moves as follows. That is, it accelerates from the surface of the cutting piece that is not attached to the workpiece (the outer edge of the workpiece), scans the surface of the workpiece at a certain speed, and then decelerates and s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/301C09J201/00C09J7/02C09J7/20C09J7/24C09J7/25C09J7/38C09J7/40
CPCC09J7/0282C09J2205/114B23K26/18C09J2203/326C09J2433/006C09J2475/006C09J2433/00B23K26/4075H01L21/6836H01L2221/68327B23K26/40C09J7/25B23K2103/50C09J2301/414
Inventor 若山洋司佐藤阳辅田矢直纪
Owner LINTEC CORP
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