Device or method for preparing solution for processing single-chip semiconductor

Abstract

The invention discloses a device for preparing chemical solution with low cost, which can control process parameters, such as chemical freshness, temperature, active ingredient yield , and the like of a use point; in addition, the device enables the parameters to keep in chamber-chamber conformity among a plurality of process cavities of a single-chip wet-method cleaning system. The invention also discloses a method which is used for controlling the detention time of the chemical solution mixture to obtain the optimal effect of the joint action of the temperature, the active ingredient reactivity and the yield of the chemical solution mixture, thereby achieving the optimal chip cleaning effect.

Description

technical field [0001] The present invention relates to the processing of semiconductor workpieces, and more particularly, to solution preparation apparatus and methods for processing monolithic semiconductor workpieces. Background technique [0002] Semiconductor components are fabricated and produced on semiconductor wafers using a number of different processing steps to create transistors and interconnecting elements. In the process of forming the interconnection elements, the semiconductor wafer may undergo processes such as masking, etching and deposition to form the semiconductor transistors and the required electronic circuits to connect the terminals of these transistors. Specifically, multiple masking, ion implantation, annealing and plasma etching, and chemical and physical vapor deposition steps may be performed to form narrow trenches, transistor wells, gates, polysilicon lines, and interconnection structures. At each step, particles and contaminants can be adde...

AI Technical Summary

Problems solved by technology

Because this method is similar to an instantaneous mixing and conveying technology, the desired process temperature may not be reached at the conveying point, unless multiple sets of heating devices built into the pipeline are added at the front of the conveying point, but this will further increase the cost of the system

Images