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Inorganic filler and composite dielectric material using the same

A technology for dielectric materials and inorganic fillers, applied in fibrous fillers, dyed low-molecular organic compound treatment, circuits, etc., can solve the problems of resin interface peeling damage, insulation degradation, poor effect, etc.

Inactive Publication Date: 2009-11-18
NIPPON CHECMICAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, perovskite-type composite oxides have been pointed out as a disadvantage that once the perovskite-type composite oxide comes into contact with water, especially the A-site metals such as Ba, Ca, Sr, and Mg in the structure will be eluted, and the leaching , causing damage such as resin interface peeling, insulation degradation due to ion migration, and other defects
[0007] However, if the particle surface of barium titanate is coated with a coupling agent alone, the effect of reducing the elution of A-site metals such as Ba is poor. Therefore, it is desired to develop inorganic fillers for composite dielectrics that reduce the elution of metals.

Method used

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  • Inorganic filler and composite dielectric material using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101]

[0102] 100 parts by weight of the perovskite-type composite oxide sample was added to 150 parts by weight of n-butanol, and the dispersion treatment was sufficiently performed to prepare a slurry.

[0103]

[0104] Next, under stirring conditions, 1.1 parts by weight of an organic solvent-based titanate-based coupling agent (manufactured by AJINOMOTOFINE-TECHNO Co., Ltd., trade name KR -TTS). Then, after adding 1 weight part of pure water similarly, it was made to react at 110 degreeC for 1 hour. After completion of the reaction, the entire amount was dried at 105° C. for 24 hours and pulverized to obtain a perovskite-type composite oxide coated with a coupling agent.

[0105] In addition, 4 g of the perovskite-type composite oxide coated with a coupling agent was dispersed in 100 mL of pure water to prepare a 4% by weight slurry, stirred at 25° C. at 100 rpm for 1 hour, and then measured with a pH meter. The pH of the supernatant, it turned out that the pH of t...

Embodiment 2

[0107] The addition amount of the titanate-based coupling agent in the A2 process of Example 1 is set to 0.60 parts by weight, except that, the same operation as in Example 1 is performed to obtain the perovskite coated with the coupling agent. Mineral composite oxides.

[0108] In addition, 4 g of the perovskite-type composite oxide coated with a coupling agent was dispersed in 100 mL of pure water to prepare a 4% by weight slurry, stirred at 25° C. at 100 rpm for 1 hour, and then measured with a pH meter. The pH of the supernatant, it turned out that the pH of the supernatant was 7.45.

Embodiment 3

[0110]

[0111] 100 parts by weight of the perovskite-type composite oxide sample was added to 300 parts by weight of pure water, and the dispersion treatment was sufficiently performed to prepare a slurry.

[0112]

[0113] Next, under stirring conditions, 10 parts by weight of a water-based titanate-based coupling agent (manufactured by AJINOMOTOFINE-TECHNO Co., Ltd., trade name KR-44 ), reacted at 25°C for 1 hour. After the reaction, solid-liquid separation was carried out by a conventional method, and then dried at 105° C. for 24 hours and pulverized to obtain a perovskite-type composite oxide coated with a coupling agent.

[0114] The pH was measured in the same manner as in Example 1. As a result, the pH of the supernatant was 7.27.

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Abstract

Disclosed is an inorganic filler which effectively suppresses dissolution of an A-site metal such as Ba, Ca, Sr and Mg of a complex perovskite oxide. In particular, this inorganic filler is suitably used as an inorganic filler for composite dielectrics. Specifically disclosed is an inorganic filler which is characterized by being composed of a complex perovskite oxide which is coated by hydrolyzing a titanate coupling agent in a solvent. In this connection, the solvent is preferably water, and the inorganic filler has a pH of not more than 8.5 when dispersed in water.

Description

technical field [0001] The present invention mainly relates to an inorganic filler using a perovskite-type composite oxide suitable for use as an inorganic filler of a composite dielectric and a composite dielectric material using the inorganic filler. Background technique [0002] In order to realize miniaturization, thinning, and high density of electronic machines, multilayer boards are often used for printed circuit boards. By providing a layer with a high dielectric constant on the inner layer or the surface layer of the multilayer printed wiring board, the actual mounting density can be increased, and further miniaturization, thinning, and high density of electronic machines can be realized. [0003] Conventional high dielectric constant materials use ceramic sintered bodies obtained by molding ceramic powder and then firing them, so their size and shape are restricted by molding methods. In addition, since the sintered body has high hardness and is brittle, it is dif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/00C09C3/08C08K9/04
CPCC01P2006/12H05K1/162C01P2002/34C09C1/00H01G4/1236H01G4/206H05K2201/0239C09C1/36H01G4/1218H05K1/0373C01P2004/62C01G23/006H05K2201/0209C08K9/04Y10T428/2991C09C3/08
Inventor 成重尚昭田边信司
Owner NIPPON CHECMICAL IND CO LTD