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Perpendicular interconnection multi-chip assembly encapsulation method by PCB substrate

A technology of multi-chip components and vertical interconnection, which is applied in the direction of electrical components, electrical solid-state devices, semiconductor devices, etc.

Active Publication Date: 2011-01-12
MEMSIC SEMICON WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Two-dimensional planar chip surface mount technology (SMT) has been very mature, but three-dimensional chip packaging, especially vertical chip packaging is still a new challenge

Method used

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  • Perpendicular interconnection multi-chip assembly encapsulation method by PCB substrate
  • Perpendicular interconnection multi-chip assembly encapsulation method by PCB substrate
  • Perpendicular interconnection multi-chip assembly encapsulation method by PCB substrate

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0022] exist Figure 2A In the process, first place the laminated PCB substrate vertically and fix it, so that the upper surface of the side wall faces upwards, which is convenient for chip surface mounting, and the solder pad pattern in the side wall cavity 12 is evenly coated with lead-free flux, and the IC or MEMS chip Flip-chip on the sidewall pad 16, and reflow and solidify the PCB substrate with the surface-mounted chip according to the high-temperature reflow curve. The peak temperature of the reflow solidification curve is 30° C. higher than the melting point of the bump 22 metal. At this time, the sidewall chip 21 forms a good electrical interconnection with the laminated PCB.

[0023] exist Figure 2B In this process, the underfill glue 24 is filled under the sidewall chips that have been flip-chip soldered, so as to improve the long-term reliability of the module. Epoxy resin 23 glue is injected into the sidewall cavity 12 to protect the vertically interconnected ...

no. 2 example

[0028] In this embodiment, IC or MEMS chips are interconnected by wire bonding to form a multi-chip module.

[0029] exist Figure 3A In the process, the laminated PCB substrate is vertically placed and fixed so that the upper surface of the side wall cavity faces upward, and the adhesive 32 is placed in the side wall cavity, and the upper surface of the vertical chip is placed in the side wall cavity 12 with the upper surface facing upward. , heating and curing the adhesive to fix the chip, and using the lead 31 to interconnect the pad on the chip with the metallized pad 16 in the side wall cavity 12 by wire bonding to form a good electrical connection.

[0030] exist Figure 3B In order to protect the wire bonding and improve the long-term reliability of the module, epoxy resin 23 glue is injected into the side wall cavity and cured.

[0031] exist Figure 3C In the process, the laminated PCB board is placed horizontally, and a patch adhesive 32 is placed on the upper sur...

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Abstract

The invention discloses a perpendicular interconnection multi-chip assembly encapsulation method by a PCB substrate, comprising following step: 1) forming one or more side wall chambers with the circuit pattern wiring on the laminated PCB substrates, wherein the side wall chamber is provided with a side wall bonding pad; forming a plane on the upper surface of the laminated PCB substrates or forming a plane with one or more surface chambers, wherein a circuit wiring for the SMT chip is arranged on the plane or in the chamber; 2) perpendicularly mounting the chips on the side wall or in the side wall chamber of the laminated PCB substrate, protecting the mounted chips by an epoxy resin glue. The invention perpendicularly mounts the chips such as IC or MENS based on the laminated PCB substrate to realize the multi-chip assembly encapsulation, thus making the chip measure the physical quantity in the perpendicular direction.

Description

technical field [0001] The invention relates to a three-dimensional packaging method of a multi-chip component, more precisely, a high-density packaging method of a multi-chip component using a printed circuit board (Printed Circuit Board, PCB) substrate, and belongs to the field of packaging of electronic devices. Background technique [0002] With the rapid development of microelectronics technology, the packaging of electronic components has begun to develop in the direction of high density, light weight, and multi-function. Multi-chip three-dimensional packaging has become the trend of this advanced packaging. Multi-chip module packaging (Multi-Chip Module, MCM) is to place multiple types of chips such as IC and MEMS in one package, so as to obtain higher packaging density. Among them, the stacked multi-chip module (MCM-L) is a multi-chip packaging technology based on a PCB substrate, which uses multi-layer PCB substrate wiring to realize the interconnection between mult...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/56H01L21/48B81C3/00
CPCH01L2224/48137H01L2224/73204H01L2224/32225H01L2924/15192H01L2924/15153H01L2224/16225H01L2924/15311H01L2224/48227H01L2224/73265H01L2924/14H01L2924/1461H01L2924/15156H01L24/73H01L2924/00012H01L2924/00
Inventor 朱大鹏段志伟陈利军
Owner MEMSIC SEMICON WUXI
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