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Insulating coating, methods of manufacture thereof and articles comprising the same

A technology for products, insulating layers, applied in the direction of final product manufacturing, sustainable manufacturing/processing, coating, etc., can solve problems such as inability to withstand high temperatures

Inactive Publication Date: 2009-12-16
GENERAL ELECTRIC CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Plastic substrates are flexible and insulating, and can also allow monolithic integration of solar cells, but cannot withstand high temperatures, thus ruling out their use in fabrication methods involving high temperatures

Method used

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  • Insulating coating, methods of manufacture thereof and articles comprising the same
  • Insulating coating, methods of manufacture thereof and articles comprising the same
  • Insulating coating, methods of manufacture thereof and articles comprising the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] This example was performed to illustrate the stability of insulating layers on metal substrates. The metal substrate includes a metal housing fabricated from stainless steel. A silicon-containing film with a thickness of 5 microns or 10 microns is deposited on the metal housing by using an expanding thermal plasma. Octamethylcyclotetrasiloxane (D 4 ) are used as precursors for paints.

[0051] Metal housings were cleaned with isopropanol, rinsed, and air dried prior to deposition. The substrates were loaded onto racks in a load lock, pumped down to approximately 26 mTorr, preheated at 1000 Watts for 10 seconds, and then introduced into the expanding thermal plasma. The expanded thermal plasma uses an atmosphere comprising argon and oxygen in a volume ratio of 1:3. Argon gas is used to form the plasma. Octamethylcyclotetrasiloxane dissociates at the high temperature of the expanding hot plasma and combines with oxygen in the plasma to form a silicon-containing insulat...

Embodiment 2

[0053] The metal substrate in this example is stainless steel foil. The stainless steel foil was treated similarly to the metal casing of Example 1 prior to the deposition of the coating in the expanding thermal plasma. The method of depositing the insulating layer in this embodiment is similar to that in Embodiment 1. The composition of the insulating layer in this example is similar to that in Example 1. The stainless steel foil with the insulating layer arranged on the surface was heat-treated at a temperature of 500° C. for 30 minutes. After heat treatment, no delamination or cracking was observed in the insulating layer.

Embodiment 3

[0054] This example was carried out to determine the quality of a multilayer device in which one of the layers is an insulating layer disposed in an expanding thermal plasma as described above. The metal substrate is a stainless steel foil similar to that in Example 2. An insulating layer was disposed on a stainless steel foil in a similar manner to that in Example 2. The thickness of the insulating layer is similar to that described in Example 2. 500 nm of molybdenum was deposited on the insulating coating by sputtering.

[0055] The system used for sputtering was a Perkin Elmer model 2400 Radio Frequency sputter coater. The type of sputtering was radio frequency (RF) planar deposition using a 6 inch circular molybdenum target (99.95% pure). Prior to deposition, samples were degreased using Genesolve solvents, then ultrasonically cleaned in acetone, followed by methanol. The vacuum in the sputter coater before deposition is 4 x 10 -7 torr. The target to substrate distan...

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Abstract

The present invention relates to insulating coating, methods of manufacture thereof and articles comprising the same. Disclosed herein is an article comprising a metallic substrate 10; an insulating layer 20; the insulating layer 20 being disposed on the metallic substrate 10 in an expanding thermal plasma; and a semiconductor layer 40; the semiconductor layer 40 being disposed on the insulating layer 20. Disclosed herein too is a method comprising disposing an insulating layer 20 on a metallic substrate; the insulating layer 20 being in intimate contact with the metallic layer; wherein the insulating layer 20 is derived from a metal-organic precursor, and wherein insulating layer 20 is deposited in an expanding thermal plasma; and disposing a semiconductor layer 40 on the insulating layer.

Description

Background technique [0001] The present disclosure relates to insulating coatings, processes for their manufacture and articles comprising the same [0002] Photovoltaic devices, ie, solar cells, are capable of converting solar radiation into usable electrical energy. The energy conversion is due to the so-called photoelectric effect. Solar radiation impinging on the solar cell and absorbed by the active regions of the semiconductor material generates electricity. Since each battery generates only a small amount of power by itself, the required voltage and / or current is achieved by interconnecting the individual batteries in series or parallel. An array can contain hundreds or thousands of cells in order to provide the required voltage or current. [0003] A module with many solar cells uses many electrical interconnections. Ideally, this interconnection process is integrated with the cell manufacturing process, ie "monolithic integration," so that the connected solar cell...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/02H01L31/0216H01L31/18C23C16/18
CPCH01L31/02C23C16/56H01L31/18C23C16/513C23C16/401Y02E10/50H01L31/0392H01L31/0322H01L31/03925H01L31/03928Y02E10/541Y02P70/50
Inventor B·A·科尔瓦尔J·N·约翰逊T·米巴赫H·A·布莱德斯J·E·皮克特
Owner GENERAL ELECTRIC CO