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Method for improving focusing and leveling measurement accuracy

A technology for focusing, leveling, and measuring accuracy, which is applied to the photoplate-making process, optics, and instruments on the patterned surface to avoid the effect of measuring repeat accuracy

Active Publication Date: 2011-03-30
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology

[0004] In order to overcome the shortcomings existing in the prior art, the present invention provides a method, which can eliminate the influence of light source life on the accuracy of measurement results, and at the same time avoid the problem of affecting the measurement repeatability due to the decrease in signal-to-noise ratio

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  • Method for improving focusing and leveling measurement accuracy
  • Method for improving focusing and leveling measurement accuracy
  • Method for improving focusing and leveling measurement accuracy

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Embodiment Construction

[0012] Below, the present invention will be further described in conjunction with the accompanying drawings.

[0013] First, please refer to figure 1 , figure 1 It is the first schematic diagram of the optical exposure system. It can be seen from the figure that under the illumination of the illumination system 100 , the light source of the illumination system 100 projects and exposes the image on the mask 220 onto the silicon wafer 420 through the projection objective lens 310 . Mask 220 is supported by mask stage 210 , and silicon wafer 420 is supported by work stage 410 . exist figure 1 Among them, there is a silicon wafer focusing and leveling measurement device 500 between the projection objective lens 310 and the silicon wafer 420, which is rigidly connected with the projection objective lens support 300, and is used for measuring the position information on the surface of the silicon wafer 420, and the measurement results are sent to The silicon wafer surface positio...

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Abstract

The invention provides a method for improving focusing and leveling measurement accuracy. The method is applied in an optical exposure system and comprises the following steps: obtaining a current driving voltage V1 of a light source of a focusing and leveling device in the system; illuminating an alignment reference plate on a workpiece table in the system by using the light source, carrying outoptical-electric signal conversion, and obtaining a peak voltage V2 of converted electric signals; detecting whether the light intensity of the light source is weakened; if so, illuminating the alignment reference plate with the light source, carrying out optical-electric signal conversion, obtaining a peak voltage V3 of the converted electric signals, calculating an optimum driving voltage V4 ofthe light source and adjusting the voltage of the light source to be the optimum driving voltage V4; and if not, maintaining the voltage of the light source to be constant. The method can discover and solve the problem of measurement accuracy decrease caused by the weakening of light intensity of the light source in time, thereby improving the focusing and leveling measurement accuracy.

Description

technical field [0001] The invention relates to the field of semiconductor photolithography, and in particular to a method for improving the measurement accuracy of focusing and leveling. Background technique [0002] In the projection lithography device, in order to measure the position of the silicon wafer surface with high precision and to avoid damage to the silicon wafer by the measuring device, the focusing and leveling measurement must be non-contact measurement, that is, the device itself does not directly contact the measured object. There are three commonly used non-contact focusing and leveling measurement methods: optical measurement method, capacitance measurement method, and air pressure measurement method. In today's scanning projection lithography apparatuses, optical measurement methods are often used to achieve focus and leveling measurements, and there are various technologies for optical focusing and leveling measurement devices. The measuring object of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F9/00H01L21/027G03F7/20
Inventor 陈飞彪
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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