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Chemical recovery method for mortar in wire cutting technology

A technology of chemical recycling and wire cutting, applied in the direction of working accessories, manufacturing tools, stone processing equipment, etc., can solve the problems of silicon wafer surface quality degradation, high scrap rate, poor uniform dispersion, etc., to reduce chemical recycling costs and save energy effect

Inactive Publication Date: 2010-01-13
JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this mortar recycling system solves the problem of mortar recycling to a certain extent, there are other defects: the method adopted by this recycling system cannot remove the metal impurities in the old mortar and the silicon powder attached to the surface of the silicon carbide abrasive, so after The recovered mortar cannot be directly recycled, and a certain proportion of new silicon carbide abrasives must be added to be used for wire cutting again. At the same time, the wire cutting process becomes unstable when it is used again due to the presence of metal impurities and silicon powder. The surface quality of the chip is reduced, and the scrap rate is high
Affected by this concept, the existing literature reports believe that the recycling of silicon carbide abrasives also needs to be dried to avoid poor uniform dispersion.

Method used

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  • Chemical recovery method for mortar in wire cutting technology

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Effect test

Embodiment 1

[0050] Embodiment 1, a chemical recovery method for mortar in a wire cutting process, its operation steps are: (1) the mixed mortar containing cutting fluid A, silicon powder, metal shavings, and silicon carbide abrasive after wire cutting is used is solidified Liquid separation to obtain liquid part B and solid part C; (2) using chemical treatment to remove silicon powder and metal filings in solid part C to obtain solid part D rich in silicon carbide abrasives; wherein: (3) will be rich in carbide The solid part D of the silicon abrasive is directly stirred with the cutting fluid E to obtain the mixture G and then used for wire cutting; the cutting fluid E is a mixture of the liquid part B and the new cutting fluid F.

Embodiment 2

[0051] Embodiment 2, a chemical recovery method for mortar in a wire cutting process, its operation steps are: (1) the mixed mortar containing cutting fluid A, silicon powder, metal shavings, and silicon carbide abrasive after wire cutting is used is solidified Liquid separation obtains liquid part B and solid part C; (2) adopts chemical treatment to remove silicon powder and metal shavings in solid part C to obtain solid part D rich in silicon carbide abrasives; The solid portion D is separated again to obtain the solid portion D1 of the coarse-grained silicon carbide abrasive and the solid portion D2 of the fine-grained silicon carbide abrasive; wherein: (3) the coarse-grained solid of the silicon carbide abrasive is enriched Part D1 is directly stirred with the cutting fluid E to obtain the mixture G and then used for wire cutting; the cutting fluid E is the liquid part B after removing appropriate moisture after heating.

Embodiment 3

[0052] Embodiment 3, a chemical recovery method of mortar in wire cutting process, the cutting fluid E used is the liquid part B after removing appropriate moisture after heating. The water content in the cutting fluid E can be controlled at 0.01% by weight, or any one of 0.1%, 0.2%, 1%, 2%, 3%, 4%, and 5%. All the other are with embodiment 2.

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Abstract

The invention relates to a recovery method for mortar in a wire cutting technology, in particular to a chemical recovery method for the mortar in the wire cutting technology. The chemical recovery method comprises the following operation steps: firstly, solid-liquid separation is carried out on the mixed mortar containing cutting liquid A, silicon powders, metal filings and silicon carbide abrasives after wire cutting to obtain a liquid part B and a solid part C; secondly, the silicon powders and the metal filings in the solid part C are removed by adopting a chemical treatment method to obtain a solid part D which is rich in the silicon carbide abrasives; and thirdly, the solid part D which is rich in the silicon carbide abrasives is directly and uniformly stirred with cutting liquid E to obtain mixed materials G, and the mixed materials G are used for wire cutting again. The invention removes metal impurities and the silicon powders, can be used for secondary cutting without drying the silicon carbide abrasives, and enables the silicon carbide abrasives and water soluble cutting liquid to be repeatedly and reasonably utilized. The use effect of recovered mortar is nearly same with the use effect of new mortar, therefore, the cost of chemical recovery of the mortar is greatly lowered.

Description

technical field [0001] The invention relates to a method for recovering mortar in a wire cutting process, in particular to a chemical recovery method for mortar in a wire cutting process. Background technique [0002] In the processing of silicon wafers, cutting silicon rods or blocks into sheets of different diameters and thicknesses through special wire cutting equipment is currently a common processing method in the world. The cutting principle is to use thousands of steel wires with a diameter of about 120-160 μm as the cutting carrier, use silicon carbide abrasives whose hardness is second only to diamond as the main cutting medium, and use silicon carbide abrasives with good wettability, strong cutting ability and strong resistance to silicon carbide Cutting fluids such as polyethylene glycol-based, propylene glycol-based or oil-based suspensions with excellent dispersing properties are used as dispersants for silicon carbide abrasives to prepare mortars that are unifo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D7/00B28D5/04
Inventor 陈骏王柳英
Owner JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD
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