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Orientation method of copper single crystal

A single crystal and single crystal ingot technology, which is applied in the field of preparation and processing of metal single crystal components, can solve the problems of inconvenient experiment and production, long orientation cycle, and low precision, and achieve environmental protection, shorten orientation time, and orientation high precision effect

Inactive Publication Date: 2010-03-03
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Difficulties in directly using X-ray diffractometer to orient copper single crystal ingots are: (1) since copper single crystal has no natural cleavage plane, there is no orientation benchmark; (2) because copper single crystal is soft, cutting and grinding will destroy copper The atomic arrangement of the crystal plane causes the X-ray diffraction spectrum of the corresponding crystal plane to have diffraction peaks of multiple crystal planes
Therefore, it is very difficult to orient copper single crystals by conventional methods.
[0003] Regarding the orientation of copper single crystals, S.M.Schwarz reported in "Bicrystal growth and characterization of coppertwist grain boundaries" (see Journal ofCrystal Growth 222 (2001) 392-398) that the back reflection Laue method is used for orientation, and its disadvantage is low precision. There are many operation steps and the orientation period is long. It usually takes several days to fully determine the orientation of a sample, which brings inconvenience to experiments and production.

Method used

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  • Orientation method of copper single crystal
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Experimental program
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Embodiment 1

[0036] In this embodiment, the copper single crystal ingot that needs to be oriented is cylindrical, and its surface has no obvious directional features, such as figure 1 shown.

[0037] The operation steps to the orientation of the above-mentioned cylindrical copper single crystal ingot are as follows:

[0038] (1) Treatment of copper single crystal ingot

[0039] Under normal pressure and room temperature (25°C), the copper single crystal ingot is etched in a nitric acid solution with a mass concentration of 35%. or so), then take the copper single crystal ingot out of the nitric acid solution and put it into a NaOH solution with a mass concentration of 5% for swing cleaning to stop the etching reaction for about 5 seconds, then wash it with deionized water until it is neutral and rinse it with alcohol and then naturally Dry, then use 0#-2#-4#-6# metallographic sandpaper to carry out coarse grinding, fine grinding, grind out a plane parallel to the reflective surface on th...

Embodiment 2

[0048] In this embodiment, the copper single crystal ingot that needs to be oriented is cylindrical, and its surface has no obvious directional features, such as figure 1 shown.

[0049] The operation steps to the orientation of the above-mentioned cylindrical copper single crystal ingot are as follows:

[0050] (1) Treatment of copper single crystal ingot

[0051] Under normal pressure and room temperature (15°C), the copper single crystal ingot is etched in a nitric acid solution with a mass concentration of 45%. or so), then take the copper single crystal ingot out of the nitric acid solution and put it into a NaOH solution with a mass concentration of 10% for swing cleaning to stop the etching reaction for about 10 seconds, then wash it with deionized water until it is neutral and rinse it with alcohol and then naturally Dry it, and then take one of the reflective surfaces as a reference surface, use 0#-2#-4#-6# metallographic sandpaper in turn for rough grinding, fine g...

Embodiment 3

[0059] In this embodiment, the copper single crystal ingot that needs to be oriented is cylindrical, and its surface has no obvious directional features, such as figure 1 shown.

[0060] The operation steps to the orientation of the above-mentioned cylindrical copper single crystal ingot are as follows:

[0061] (1) Treatment of copper single crystal ingot

[0062] Under normal pressure and room temperature (20°C), the copper single crystal ingot is etched in a nitric acid solution with a mass concentration of 45%. or so), then the copper single crystal ingot is taken out from the nitric acid solution and put into NaCO with a mass concentration of 15%. 3 Swing and wash in the solution to stop the etching reaction for about 10 seconds, then wash with deionized water until neutral, rinse with alcohol and dry naturally, then use one of the reflective surfaces as a reference surface, and use 0#-2# -4#-6# metallographic sandpaper is carried out coarse grinding, fine grinding, gr...

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Abstract

The invention provides an orientation method of copper single crystal, comprising the steps: (1) putting the copper single crystal into nitric acid with 35-45% of mass concentration and etching, wherein etching time is limited by that the surface of copper single crystal ingot has at least one group of light reflecting faces with accordant orientation, taking the group of light reflecting faces asa reference surface, grinding a plane parallel with the reference surface on the copper single crystal ingot, and defining the plane as a primary plane; (2) X-ray diffraction theta-2theta linked scanning and analyzing the primary plane on the copper single crystal ingot with an X-ray diffractometer, and determining a crystal face index (khl) corresponding to the strongest peak in an X-ray diffraction spectrogram as the crystal face index of orientated crystal face; and (3) modifying the primary plane on the copper single crystal ingot by means of X-ray diffracting oscillation method to obtaina final modified face, wherein the normal line of the final modified face is parallel with that of the orientated crystal face (hkl); and (4) removing a disturbed atomic layer on the surface of the final modified face by means of grinding and physical-chemical polishing to obtain the exactly orientated crystal face (hkl).

Description

technical field [0001] The invention belongs to the field of preparation and processing of metal single crystal components, and in particular relates to an orientation method of copper single crystals without orientation characteristics. Background technique [0002] Copper single crystals are ideal materials for neutron monochromators. Copper single crystals prepared by the Bridgman-Stockbarger method (B-S method) are usually cylindrical ingots with no obvious directional characteristics in appearance. The processing and fabrication of devices must first Orient it. Difficulties in directly using X-ray diffractometer to orient copper single crystal ingots are: (1) since copper single crystal has no natural cleavage plane, there is no orientation benchmark; (2) because copper single crystal is soft, cutting and grinding will destroy copper The atomic arrangement of the crystal plane causes the X-ray diffraction spectrum of the corresponding crystal plane to appear multiple d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P17/04
Inventor 赵北君朱世富肖怀安唐世红何知宇陈宝军
Owner SICHUAN UNIV
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