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Method of processing glass substrate surface

A glass substrate and glass technology, applied in glass forming, thin material processing, glass manufacturing equipment, etc., can solve the problem of impossible uniform processing of glass substrates, and achieve the effect of excellent flatness

Inactive Publication Date: 2010-03-24
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] However, the present inventors have found that when using those methods of irradiating the surface of a glass substrate with a beam or irradiating the surface of a glass substrate with a laser, there is a problem that it is impossible to uniformly process the entire glass substrate

Method used

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  • Method of processing glass substrate surface
  • Method of processing glass substrate surface
  • Method of processing glass substrate surface

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Experimental program
Comparison scheme
Effect test

Embodiment

[0107] The present invention will be explained in more detail with reference to the following examples, but the present invention should not be construed as being limited thereto.

[0108] (Example)

[0109] Prepare a 152 mm square glass substrate made of low expansion glass (containing TiO 2 quartz glass substrate) and preprocessed by mechanical grinding to a flatness of 268 nm (the flatness value of the above-mentioned integral part) and a surface roughness of 0.11 nm. by Figure 1~3 A frame 20 is provided along the periphery of the pretreated glass substrate 10 in the manner shown in FIG. Processing surface 12 of glass substrate 10 in this state is processed by gas cluster ion beam etching. The used frame 20 is made of the same low-expansion glass (containing TiO 2 made of quartz glass), and the width h of the frame member 22 is 5mm. The conditions of the gas cluster ion beam etching are as follows.

[0110] Raw gas: 5% NF 3 and 95% of N 2 (vol%) gas mixture

[011...

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Abstract

The present invention is to provide a method for processing the whole of a glass substrate surface so as to give a surface excellent in flatness and surface roughness. The present invention provides amethod of processing a glass substrate surface using a processing technique selected from the group consisting of ion-beam etching, gas cluster ion-beam etching, plasma etching, and nano-ablation, wherein a frame element satisfying the following (1) and (2) is arranged along the periphery of the glass substrate before the glass substrate surface is processed: (1) the difference between the heightof the frame element and the height of the glass substrate surface is 1 mm or smaller; and (2) the frame element has a width which is not smaller than one-half the beam diameter or laser light diameter to be used in the processing technique.

Description

technical field [0001] The present invention relates to a method of treating the surface of a glass substrate. More particularly, the present invention relates to a method for processing the surface of a glass substrate so that the surface has excellent flatness and surface roughness as a reflective mask for EUV (extreme ultraviolet) lithography in a semiconductor device manufacturing step. glass substrate. Background technique [0002] In photolithography, exposure tools have been widely used to transfer fine circuit patterns onto wafers to manufacture integrated circuits. With the trend toward higher integration, higher speed, and higher functionality in integrated circuits, integrated circuits have become finer. Exposure tools are required to form high-resolution circuit pattern images on wafer surfaces at long focal depths and facilitate shortening the wavelength of exposure light. In addition to the g-line (wavelength of 436nm), i-line (wavelength of 365nm), and KrF ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B19/14C03C15/00C03C15/02C03C19/00C03C23/00
CPCC03C17/3665C03C15/02C03C23/0025C03C2218/31C03C2204/08C03C23/006Y10T428/24777C03B19/14C03C15/00B82Y40/00
Inventor 冈村研治伊藤正文
Owner ASAHI GLASS CO LTD