Method for manufacturing high-power white light LED

Abstract

The invention discloses a method for manufacturing a high-power white light LED, comprising the following steps: electroplating silver or aluminum on a ceramic substrate 1 to cover a solid crystal region and print a circuit; b, injecting the silver to a pore path of the ceramic substrate 1 to connect a radiation heat sink 2; c, fixing a wafer 3 by using a silver glue and welding a connection circuit by using a gold wire 4; d, placing a porous metal template 5 on the ceramic substrate 1; e, injecting silica gel fluorescent powder into each pore path 51 of the metal template 5 and covering the wafer 3 and the gold wire 4; f, baking the silica gel; g, taking the metal template 5 out to form a plurality of fluorescent silica gel layers 6; h, covering the other metal template on the fluorescent silica gel layers 6 and injecting the silica gel into a hemisphere concave cavity of the metal template; and i, baking the silica gel to form a silica gel lens 7 and cutting the silica gel lens after demoulding. The method solves the problem of bad consistency and yellow ring of the high-power white light LED and realizes evenness of the coating of the fluorescent powder without needing a special customized wafer.

Description

Technical field [0001] The invention relates to an LED manufacturing method, in particular to a high-power white light LED manufacturing method, and belongs to the technical field of lighting. Background technique [0002] At present, high-power white light LEDs are generally produced using PPA plastic, embedded high thermal conductivity copper alloy heat sink, and coated with phosphor on the blue chip. When the phosphor is excited by blue light, it emits yellow light, and the blue and yellow light are mixed to form white light. The phosphor coating method is divided into the dispensing method and the printing method on the surface of the wafer. When the dispensing method is used, the manufacturing consistency is poor, and the yellow circle problem is easy to occur; the printing method is complicated and the special customized light-emitting chip must be used It can be realized, the production cost is high, and the general manufacturer cannot realize it. Therefore, solving the t...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a method for manufacturing high-power white light LEDs, which can realize the uniformity of phosphor powder coating, and does not require special custom-made wafers, and overcomes the poor consistency and disadvantages brought about by the existing high-power white light LED production methods. yellow circle problem

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