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Organic silicon resin encapsulant of large power LED and preparing method thereof

A technology of resin encapsulation and silicone, which is applied in the direction of electrical components, circuits, semiconductor devices, etc.

Inactive Publication Date: 2010-05-26
陈俊光
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult for general silicone resins to break through the above-mentioned shackles and ensure the performance of high-power LED resin encapsulation materials

Method used

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  • Organic silicon resin encapsulant of large power LED and preparing method thereof
  • Organic silicon resin encapsulant of large power LED and preparing method thereof
  • Organic silicon resin encapsulant of large power LED and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] Embodiment 1: Preparation of the one-component silicone resin encapsulant of the present invention.

[0082] Synthesis and purification of component A

[0083] 1. Raw materials

[0084] ①Phenyltrichlorosilane, methylvinyldichlorosilane, and trimethylchlorosilane must be rectified, and the chromatographic purity of the middle part (head and tail parts) should be above 99.1%. Sealed for later use, steamed and used now.

[0085] ② Use the solvent toluene after distillation, and take the middle part (remove the head and tail part).

[0086] ③ Pure water is used for hydrolysis and washing.

[0087] 2. Synthesis reaction and refining

[0088] In the flask, 600 g of toluene and 350 g of pure water were added, stirred and mixed, and the mixture (169.2 g of phenyltrichloroalane, 28.2 g of methylvinyldichlorosilane) was added dropwise over about 40 minutes. After dropping, stir at 65°-70°C for 1 hour to carry out hydrolysis polycondensation reaction. Then the acidic aqueous...

Embodiment 2

[0122] Embodiments 2 and 3 The basic raw material polymer and diluent used in the two-component silicone resin encapsulation compound of the present invention and the solidification examples 2 and 3 are all of the same product, and the dosage is the same, only the crosslinking agent component Not the same, now the preparation methods of this example 2 and example 3 will be explained together, and the preparation will be explained separately.

[0123] Synthesis and purification of component A

[0124] 1. Raw materials:

[0125] ①Dimethyldichlorosilane, methylvinyldichlorosilane, and phenyltrichlorosilane are all purchased from outsiders. They need to be rectified again, and the middle part is taken to ensure a purity of about 99.5%. Sealed and stored for future use, no metal ions remain .

[0126] ② The solvent toluene isopropanol must be re-distilled before use.

[0127] ③ Pure water is used for hydrolysis and washing.

[0128] 2. Synthesis reaction and refining

[0129] ...

Embodiment 3

[0189] Example 3: Preparation of two-component silicone resin encapsulant

[0190] Accurately add the refined and qualified products of the following components

[0191] Component A base resin is taken with the consistent structure 100g in the above-mentioned embodiment example two

[0192] Component B-1 diluent takes the same structure as 11.1g in the above-mentioned embodiment example two

[0193] Component B-2 diluent takes the same structure as 22.2g in the above-mentioned embodiment example two

[0194] Component C, 85g of methyl phenyl siloxane resin oligomer containing H groups, its average composition formula is 0.5 segments of D31, 0.5 segments of D18, H content of 0.53% by mass, SiH / SiCH=CH 2 The matching of this example is 1:1

[0195]

[0196] Component D, platinum catalyst (platinum content is 5%) platinum-1.3-divinyltetramethyldisiloxane mixture (self-made) 0.22g, the amount of platinum added is 11ppm of the total amount of silfluorone added.

[0197] Comp...

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Abstract

The invention relates to organic silicon resin encapsulant of large power LED and a preparing method thereof. The encapsulant is prepared by mixing composition A containing vinyl-containing polysiloxane as basic resin, composition B containing vinyl polysiloxane thinning agent, composition C containing hydrogen-containing polysiloxane, platinum catalyst composition D, catalytic inhibitor composition E and tackifier composition F; and the organic silicon resin encapsulant with high refractive index is obtained, and can be used for the encapsulation of various large power LEDs and the potting of other optical purposes. The method solves the problems of the increasing of resin molecular weight and the dissolving preparation of high molecular weight, and the like, by adopting thinning agent method, changes the toughness of resin by adopting cyclosiloxane as cross linker, and improves and maintains the refractive index by adopting refinement method. The method has the advantages that single component package mode and double component package mode can be prepared, the adaptability and the efficiency of encapsulation equipment and processing procedure can be improved, the cost is reduced, and the use is convenient.

Description

(1) Technical field [0001] The invention relates to a packaging material for high-power LEDs, in particular to a silicone resin packaging material for high-power LEDs, and also relates to a preparation method for the packaging material. (2) Technical background [0002] Ultra-high brightness light-emitting diode LIGHE EMITTING DIODE (LED) is a kind of electroluminescent solid light source. Due to its simple structure and long service life, small size and high brightness, obvious power saving, environmental protection and other advantages, it has developed very rapidly. As the use of power increases, the temperature difference in the use environment will increase, and the service life will be further improved, which puts forward higher adaptability requirements and selection criteria for the resin used for LED potting. [0003] At present, the resin materials used in the packaging of general power LEDs are mainly traditional transparent epoxy resins, acrylic resins, polycarb...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K5/549H01L33/56
Inventor 陈俊光
Owner 陈俊光
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