A molecular beam epitaxy growth method of Gaas-based inas1-xsbx/insb multi-quantum well films
A technology of inas1-xsbx, molecular beam epitaxy, applied in the direction of polycrystalline material growth, single crystal growth, crystal growth, etc. Low dislocation, smooth surface effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment approach 1
[0014] Specific implementation mode 1: In this implementation mode, GaAs-based InAs 1-x Sb x The molecular beam epitaxy growth method of InSb multi-quantum well film is realized through the following steps: 1. Degassing and deoxidation film: Heating the GaAs substrate to 400°C, then keeping it warm and degassing for 50-90min, and then raising the temperature to 610°C ~630℃, then keep warm for 10~20min; 2. Growth of GaAs buffer layer: control GaAs substrate temperature to 580~600℃, Ga beam current to 6×10 -7 mbar, As beam current is 1.2×10 -5 mbar, the growth time is 18-22min; 3. Growth of low-temperature InSb buffer layer: control the GaAs substrate temperature to 300°C, control the growth rate of In to 200nm / h, In and Sb 4 The beam current ratio is 0.85:1, and the growth time is 8 to 12 minutes; 4. Growth of normal temperature InSb buffer layer: control the substrate temperature to 400°C, control the growth rate of In to 1μm / h, In and Sb 4 The beam current ratio is 1:2, an...
specific Embodiment approach 2
[0018] Embodiment 2: The difference between this embodiment and Embodiment 1 is that in Step 1, the GaAs substrate is first heated and degassed at 400° C. Under protection, heat up to a certain temperature (deoxidation film temperature), and keep warm at the deoxidation film temperature for 10 to 20 minutes. After the diffraction pattern of the high-energy electron diffractometer appears clear 2x4 reconstructed surface stripes, the oxidation will be removed. membrane. Other steps and parameters are the same as those in Embodiment 1.
[0019] In this embodiment, the temperature of the deoxidized film is different for different GaAs substrates; the temperature of the deoxidized film using a no-clean GaAs (001) substrate (provided by Zhongke Galling Semiconductor Co., Ltd.) is 610°C.
specific Embodiment approach 3
[0020] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the temperature of the GaAs substrate in step 2 is controlled to be 30° C. lower than the temperature of the deoxidized film in step 1. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.
PUM
| Property | Measurement | Unit |
|---|---|---|
| surface roughness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 