Multilayer LED chip structure and preparation method thereof
A technology of LED chips and buffer layers, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as the inability to meet the requirements of high-power, high-efficiency LEDs and LDs
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[0048] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail in conjunction with specific embodiments and with reference to the accompanying drawings.
[0049] Such as figure 1 As shown, figure 1 It is a flow chart of a method for preparing a multilayer LED chip structure provided by the present invention. The method includes the following steps:
[0050] Step 1: Cleaning and nitriding the surface of the sapphire substrate;
[0051] In this step, cleaning and nitriding the surface of the sapphire substrate specifically includes: putting the sapphire substrate at a high temperature of 1100°C and using H 2 The surface of the substrate is cleaned; then the temperature is reduced to 500° C., and the surface of the sapphire substrate is nitridated.
[0052] Step 2: epitaxially grow a GaN buffer layer on the processed sapphire substrate;
[0053] In this step, a GaN buffer layer wi...
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