Molecular environment-friendly heat-release welding agent applicable to welding of copper conductor

An exothermic flux, molecular-level technology, applied in the direction of welding medium, welding equipment, welding equipment, etc., can solve the problems of uneven heat, endangering the safety of operators, and inability to melt completely, achieving excellent anti-corrosion performance, meeting welding requirements, The effect of fast welding speed

Inactive Publication Date: 2010-06-23
XIAN JSBOUND TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this patent application are: 1. The heat of reaction is not high, and only part of the joints can be melted, but not all of them, and the real molecular-level connection cannot be realized; 2. At the moment of welding reaction, due to the gasification of welding slag, a large amount of harmful gas is produced ,

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A new type of molecular-level environment-friendly exothermic flux suitable for copper conductor welding, which is prepared from the following raw materials in proportions by weight: the oxidation rate of copper oxide in copper powder is 55%, and the copper oxide 65% of 40-80 mesh 15 parts of 60-80 mesh aluminum powder, 1 part of 100-200 mesh alumina, 1 part of 300 mesh calcium fluoride, 3 parts of 300 mesh graphite powder.

[0013] According to the above ingredients and parts by weight, the product of the present invention is obtained through jet mixing and uniform stirring.

[0014] The preparation method is a conventional process method: according to the above components, through the configuration of component detection-particle size screening-jet mixing-uniform stirring-quantitative packaging; the actual dosage is selected according to the cross-sectional area of ​​the weldment, and finally completed under the action of ignition powder welding. .

[0015] Explanat...

Embodiment 2

[0019] A new type of molecular-level environment-friendly exothermic flux suitable for copper conductor welding, which is prepared from the following raw materials in proportions by weight: the oxidation rate of copper oxide in copper powder is 50%, 40 mesh-80 mesh copper oxide 50 20 parts of 60-80 mesh aluminum powder, 2 parts of 100-200 mesh alumina, 2 parts of 200-400 mesh calcium fluoride, 4 parts of 200-400 mesh graphite powder.

[0020] Its preparation method is with embodiment 1.

Embodiment 3

[0022] A new type of molecular-level environmentally friendly exothermic flux suitable for copper conductor welding, which is prepared from the following raw materials in proportions by weight: the oxidation rate of copper oxide in copper powder is 60%, 40-80 mesh copper oxide 75 10 parts of 60-80 mesh aluminum powder, 0.5 part of 100-200 mesh alumina, 0.5 part of 200-400 mesh calcium fluoride, 2 parts of 200-400 mesh graphite powder.

[0023] Its preparation method is with embodiment 1.

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PUM

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Abstract

The invention discloses a heat-release welding agent for welding metal, and particularly relates to a novel molecular environment-friendly heat-release welding agent applicable to welding of copper conductors. The heat-release welding agent is prepared by the following ingredients according to weight part ratio: 50-75 parts of copper oxide with oxidation ratio of 50-60 percent and 40-80 meshes, 10-20 parts of aluminium powder with 60-80 meshes, 0.5-2 parts of aluminium oxide with 100-200 meshes, 0.5-2 parts of calcium fluoride with 200-400 meshes and 2-4 parts of graphite powder with 200-400 meshes. The novel molecular environment-friendly heat-release welding agent realizes the welding of copper conductors by the basic thermite reaction principle. By comprehensive experiment of the proportion and used materials of the formula, the novel molecular environment-friendly heat-release welding agent meets the temperature requirements of 3000 DEG C/200g welding powder, so as to melt welding joints of the conductors completely and realize molecular welding. In addition, by adding the matters of graphite powder and aluminum oxide and the like to absorb harmful gases generated after reaction, the novel molecular environment-friendly heat-release welding agent realizes pollution-free welding.

Description

technical field [0001] The invention relates to a flux for welding metals, in particular to a flux suitable for welding copper conductors. Background technique [0002] Copper welding has always been a difficult problem. In the traditional welding process, argon arc welding is generally used for the welding of copper conductors. There are disadvantages such as complicated welding process, poor welding quality and high welding technology requirements. [0003] CN 1371781 A patent application applies the principle of thermite reaction, that is, utilizes the oxidation-reduction reaction between aluminum powder and copper oxide to generate huge heat instantly to melt the soldering part of the conductor and realize molecular-level connection. The disadvantages of this patent application are: 1. The heat of reaction is not high, and only part of the joints can be melted, but not all of them, and the real molecular-level connection cannot be realized; 2. At the moment of welding re...

Claims

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Application Information

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IPC IPC(8): B23K35/34B23K23/00
Inventor 李浩谦吕军平
Owner XIAN JSBOUND TECH CORP
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