Avalanche photodiode
An avalanche photoelectric and diode technology, applied in circuits, electrical components, semiconductor devices, etc., can solve difficult problems and achieve low power consumption
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Embodiment approach 1
[0026] figure 1 is a schematic cross-sectional view of an avalanche photodiode in Embodiment 1 for implementing the present invention. In this embodiment, the first conductivity type is n-type and the second conductivity type is p-type for description.
[0027] figure 1 Among them, a low-resistance n-type InP material substrate 10 is formed on the first main surface with a film thickness of 0.1-1 μm and a carrier concentration of 1-5×10 18 cm -3 , The buffer layer 20 of n-type InP material. Formed on the buffer layer 20 with a film thickness of 0.1 to 0.5 μm and a carrier concentration of 0.1 to 3×10 15 cm -3 . The avalanche multiplication layer 30 of undoped AlInAs material. Formed on the avalanche multiplication layer 30 with a film thickness of 0.01 to 0.1 μm and a carrier concentration of 0.1 to 1×10 18 cm -3 . The electric field adjustment layer 40 made of p-type InP material. On the electric field adjusting layer 40, an undoped light absorbing layer 51 of GaInAs...
Embodiment approach 2
[0076] Figure 11 is a cross-sectional view showing a schematic structure of an avalanche photodiode according to Embodiment 2 of the present invention. exist Figure 11 In Embodiment 1, the window layer 60 having a double-layer structure is formed with one layer of p-type window layer 63, an etching stop layer 160 is provided between the p-type window layer 63 and the light absorbing layer 50, and the p-type window layer 63 Except that island-shaped annular grooves 150 having a diameter of 20 to 100 μm and having a desired light-receiving size are provided thereon, it is the same as Embodiment 1, and thus detailed description thereof will be omitted.
[0077] Here, the p-type window layer 63 is an AlInAs material with a thickness of 0.5-2.0 μm, and a carrier concentration of 0.3-3×10 16 cm -3 ; The etch stop layer 160 has a film thickness of 0.01-0.05 μm and a carrier concentration of 0.3-3×10 16 cm -3 , n-type InP material. In addition, the carrier concentration of the...
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