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Test cell conditioner (tcc) surrogate cleaning device and method thereof

A technology for cleaning devices and test units, applied in cleaning methods and utensils, measuring devices, chemical instruments and methods, etc., can solve problems such as inability to efficiently perform work, lengthy operation, etc., to improve reliability, reduce production costs, Efficiency-enhancing effect

Inactive Publication Date: 2010-07-14
JTRON TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Probe tips are etched and cleaned prior to testing, but the test run would be too lengthy to work efficiently

Method used

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  • Test cell conditioner (tcc) surrogate cleaning device and method thereof
  • Test cell conditioner (tcc) surrogate cleaning device and method thereof
  • Test cell conditioner (tcc) surrogate cleaning device and method thereof

Examples

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Embodiment Construction

[0028] The present invention relates to a method of cleaning a carrier board test socket or socket of an integrated circuit device, while the associated pin assembly has a test cell controller instead of a cleaning device, and the device performs a process similar to that performed under actual test conditions The way semiconductor devices are packaged is cleaning. The most likely implementation of the test cell controller instead of the cleaning device is implemented in the method.

[0029] The test unit controller replaces the cleaning device and the device of the present invention in an automated test facility, wherein an embodiment comprises the following components ( figure 1 ):

[0030] The main test frame 1 is equipped with a plurality of customized device trays or JEDEC standard trays 12 , 13 , 15 , 16 , and a carrier board 11 , test plugs or chip test sockets 7 .

[0031] At least one pick and place device.

[0032] A plurality of semiconductors or semiconductor de...

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PUM

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Abstract

A test cell conditioner (TCC) surrogate cleaning device for cleaning the pin elements in a socket or electrical interface receptacle of a load board includes a main testing frame, a plurality of trays, testing chip receptacles and one or more pick up devices. Chips to be tested (electronic elements) are entrained on a tray, and a plurality of adhesive cleaning chips are entrained on another tray. The adhesive cleaning chip contains a solid layer and an adhesive layer, and an abrasive material is mingled in the adhesive layer. The pick up device removes the adhesive cleaning chip to a position above the testing chip receptacle and cleans up the oxides and other foreign materials sticking on the receptacle by absorption or abrasion. Interrupting the operation of the apparatus to clean the test probe by etching can be excluded so as to improve the working efficiency.

Description

technical field [0001] The present invention relates to a method of cleaning a carrier board test socket or socket of an integrated circuit device, while the associated pin assembly has a test cell controller instead of a cleaning device, and the device performs a process similar to that performed under actual test conditions The way semiconductor devices are packaged is cleaning. Background technique [0002] To keep pace with the advancement of computer technology, the arrangement of computer-related equipment is changing every day. As the need for quality upgrades is becoming more stringent, the pattern of using the same memory chips won't last long. [0003] Semiconductor assembly procedures typically include layer stacking, patterning, doping, and heat treatment. After the above-mentioned test steps, the wafer is cut into chips, and the subsequent packaging and assembly are carried out. [0004] A semiconductor device includes a plurality of solder pads, which are co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00G01R1/02G01R31/26H01L21/00
CPCH01L22/30
Inventor 林益民杨忠宪艾伦·哈佛瑞杰瑞·伯兹
Owner JTRON TECH