Chemical composition plating method for preparing supported platinum bimetallic alloy composite material

A technology for chemical composite plating and composite materials, applied in the field of bimetallic alloy material preparation, can solve the problems of complex preparation process and high cost, and achieve the effects of good preparation repeatability, low cost and convenient operation

Inactive Publication Date: 2010-07-14
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It should be noted that the traditional method of loading or depositing platinum-based bimetals is the impregnation-hydrogen reduction method, which has the disadvantages of complicated preparation process and high cost.

Method used

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  • Chemical composition plating method for preparing supported platinum bimetallic alloy composite material
  • Chemical composition plating method for preparing supported platinum bimetallic alloy composite material
  • Chemical composition plating method for preparing supported platinum bimetallic alloy composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Embodiment 1 prepares platinum-iridium bimetallic composite material 5%Pt-1%Ir / activated carbon

[0040] Activated carbon was heat-treated at 120°C for 4 hours; then, by dipping, the heat-treated substrate was dipped in platinum sensitizing solution-chloroplatinic acid aqueous solution, and dried at 120°C to obtain the pre-activated body, wherein platinum for sensitization accounts for 1% of the mass of activated carbon; the resulting activated precursor is added to KBH 4 Reduction is carried out in the solution, the molar ratio of the reducing agent to the activated noble metal in the activated precursor is 20:1, the reduction time is 5 minutes, and the activated precursor after the reduction is washed with deionized water until the washing solution is neutral, that is, obtained Substrate after activation; The substrate after the gained activation is directly placed in the platinum-iridium bimetallic alloy electroless plating bath and carries out electroless plating, a...

Embodiment 2

[0041] Embodiment 2 prepares platinum-iridium bimetallic composite material 1%Pt-50%Ir / Al 2 o 3

[0042] Will Al 2 o 3 Heat treatment at 450°C for 2 hours; then, use the dipping method to dip the heat-treated substrate into iridium sensitizing solution-chloroiridic acid aqueous solution, and dry at 200°C to obtain an activated precursor, wherein Sensitization with iridium accounted for Al 2 o 3 5% by mass; the resulting activated precursor was added to NaBH 4 Reduction is carried out in the solution, the molar ratio of the reducing agent to the activated noble metal in the activated precursor is 10:1, the reduction time is 60 minutes, and the activated precursor after the reduction is washed with deionized water until the washing solution is neutral, that is, obtained Substrate after activation; The substrate after the gained activation is directly placed in the platinum-iridium bimetallic alloy electroless plating solution and carries out electroless plating, and platin...

Embodiment 3

[0043] Embodiment 3 prepares platinum-rhenium bimetallic composite material 10%Pt-0.1%Re / CeO 2 -ZrO 2

[0044] CeO 2 -ZrO 2 Heat treatment at 500°C for 2 hours; then, use the impregnation method to dip the heat-treated substrate into the platinum sensitizing solution-ethanol solution of chloroplatinic acid, and dry it at room temperature to obtain the activated precursor. Among them, the sensitization uses platinum to account for CeO 2 -ZrO 2 1% of the mass; the obtained activated precursor is added to the hydrazine hydrate solution for reduction, the molar ratio of the reducing agent to the activated noble metal in the activated precursor is 20:1, the reduction time is 30 minutes, and the deionized water is used for washing and reducing After the activation of the precursor, until the washing solution is neutral, the substrate after the activation is obtained; the substrate after the activation is directly placed in the platinum-iridium bimetallic alloy electroless plati...

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Abstract

The invention relates to a chemical composition plating method for preparing a supported platinum bimetallic alloy composite material, which belongs to the technical field of the preparation of the bimetallic alloy material. A chemical platinum plating layer prepared by using the single platinum chemical planting method has bad performance and higher cost. For improving the performance of the single platinum planting layer and reducing the usage of the noble platinum, the invention provides the chemical composition plating method for depositing a platinum bimetallic alloy, which comprises three steps of pretreatment of a matrix, activation of the matrix, chemical composition plating and heat treatment after planting. After being subjected to pretreatment and activation, inorganic oxides, composite oxides and a carbon carrier or a molecular sieve matrix are added into platinum-rhenium or platinum-iridium bimetallic chemical plating solution to carry out bimetallic chemical composition planting, and the obtained sample is subjected to heat treatment to obtain the supported platinum bimetallic alloy composite material. The platinum bimetallic alloy composite material prepared by the method has the characteristics of low cost, sintering resistance and excellent catalytic performance.

Description

technical field [0001] The invention relates to a chemical composite plating method for preparing a platinum-based bimetallic alloy composite material, and belongs to the technical field of bimetallic alloy material preparation. Background technique [0002] Electroless plating (Electroless plating) is through the appropriate reducing agent in the solution (usually including H 2 PO 2 - , N 2 h 4 and BH 4 - etc.) The metal deposition process is carried out by reducing metal ions under the self-catalysis of the substrate surface. So far, the development of electroless plating has a history of more than 50 years. In the 1940s, A.Brenner and G.Riddell of the National Bureau of Standards developed a working electroless nickel plating solution and conducted related scientific research. They are considered to be the real founders of electroless plating technology. Early electroless plating research mainly focused on the electroless plating of nickel and its alloys. After m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44C23C18/18
Inventor 王来军王志超张平陈崧哲徐景明陈靖
Owner TSINGHUA UNIV
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