Organic el device manufacture apparatus, deposition apparatus and deposition method thereof, liquid crystal display manufacture apparatus, alignment apparatus and alignment method

Abstract

The invention provides an organic EL device manufacture apparatus or deposition apparatus that can reduce affection of flexing of substrate and mask or warping of shadow mask, can reduce the generation of powder dust and gas in the vacuum by high precision deposition or configuring the drive part at the atmosphere side, and has high production character, high maintenance character and high work efficiency. Also provided is an alignment device and alignment method that can perform high precision positioning. The invention is characterized in that: firstly, the shadow mask is in contraposition to the substrate in a dependent pose to deposit the deposition material on the substrate; secondly, a permeation type using the light incident on the positioning through hole arranged on the shadow mask to perform positioning; and thirdly, the deposition is performed by reducing the warping of the shadow mask.

Description

technical field [0001] The present invention relates to an organic EL device manufacturing device, a film forming device and a film forming method thereof, a liquid crystal display substrate manufacturing device, a positioning device and a positioning method, and particularly relates to an organic EL device manufacturing device, a film forming device and a liquid crystal display device suitable for positioning a large substrate. Displays the substrate manufacturing equipment. Background technique [0002] As a powerful method for manufacturing an organic EL device, there is a vacuum evaporation method. The vacuum evaporation method requires positioning of a substrate and a mask. With the increase in the size of the substrate being processed year by year, the specification of the 6G generation substrate has become 1500mm×1800mm. When the size of the substrate increases, the size of the mask naturally increases, and its size reaches about 2000mm×2000mm. In particular, if a ...

AI Technical Summary

Problems solved by technology

However, the reflective optical system has the following problems, and there is a problem that it cannot be positioned with good accuracy

(1) Due to the halo caused by the mirror finish on the surface of the mask, the illumination intensity cannot be increased, and if it is lowered, the metal part cannot be detected

(2) In order not to damage the surface of the substrate during positioning, it is necessary to provide a gap of about 0.5 mm between the mask and the mask, but the image becomes blurred due to the reduced depth of field of the reflective optical system

[0008] Secondly, in the method disclosed in Patent Document 1, since the entire mechanism for positioning the substrate and the mask is placed in a vacuum, dust and heat accompanying the movement of the drive unit or the like may be generated or may be emitted from the drive unit. The gas from the wiring, the gas from the lubricant, and the gas from the surface of the component reduce the vacuum degree

First, the dust that goes into the vacuum adheres to the substrate and the mask and causes poor deposition. Second, the thermal expansion of the mask caused by heat generation changes the deposition specifications. Third, the gas reduces the degree of vacuum. Therefore, there is a problem that the yield rate, that is, the productivity, decreases.

[0009] In addition, since the entire mechanism for positioning the substrate and the mask is installed in a vacuum, once a failure occurs in the drive unit, etc., repairs will take time, and the device will Problems such as decreased work efficiency

Images