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Aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive and preparation method thereof

A technology of methyl silicone resin and phenolic resin, which is used in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of high energy consumption and high curing temperature of high temperature resistant phenolic resin adhesives. Effects of reduced energy consumption, good toughness and heat resistance

Inactive Publication Date: 2010-08-04
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention aims to solve the problem that the existing high-temperature-resistant phenolic resin adhesive has a high curing temperature and causes large energy consumption in the bonding process, and provides a double-modified phenolic resin adhesive of aluminate and methyl silicone resin and a preparation method thereof

Method used

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  • Aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive and preparation method thereof
  • Aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive and preparation method thereof

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specific Embodiment approach 1

[0007] Specific implementation mode one: the aluminum acid and methyl silicone resin double-modified phenolic resin adhesive of this embodiment is made of phenol, formaldehyde, zinc oxide, aluminate and methyl silicone resin; wherein phenol, mass concentration is 35% The mass ratio of ~37% formaldehyde, zinc oxide, aluminate and methyl silicone resin is 100:90~110:1.5~2.5:8~12:8~12.

[0008] The double-modified phenolic resin adhesive of alumina acid and methyl silicone resin in this embodiment has good toughness and heat resistance, and the curing temperature is 150°C, which is 15% to 25% lower than the curing temperature of the existing high temperature resistant phenolic resin adhesive. . The resin can be sintered into a mixture of alumina, aluminum silicate and graphite under high temperature conditions, so as to achieve the purpose of high temperature resistance. The thermogravimetric analysis of the cured product of the aluminum acid and methyl silicone resin double-mod...

specific Embodiment approach 2

[0009] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the mass ratio of phenol, formaldehyde with a mass concentration of 35% to 37%, zinc oxide, alumina and methyl silicone resin is 100:92 to 108: 1.6~2.3: 8.5~11.5: 8.5~11.5. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0010] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the mass ratio of phenol, formaldehyde with a mass concentration of 35% to 37%, zinc oxide, aluminate and methyl silicone resin is 100:100: 2:10:10. Others are the same as in the first or second embodiment.

[0011] Specific embodiment three: the preparation method of the double-modified phenolic resin adhesive of aluminum acid and methyl silicone resin of the present embodiment is carried out according to the following steps: 1. According to phenol: formaldehyde with a mass concentration of 35% to 37%: zinc oxide: aluminum Acid: methyl silicone resin = 100: 90-110: 1.5-2.5: 8-12: 8-12 mass ratio Weigh phenol, formaldehyde, zinc oxide, aluminum acid and methyl Silicone resin; 2. Add the phenol weighed in step 1, formaldehyde and zinc oxide with a mass concentration of 35% to 37% into the reaction kettle, heat up to 97°C to 100°C and keep it for 1.8h to 2.3h; 3. ...

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Abstract

The invention discloses an aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive and a preparation method thereof, relates to a phenol formaldehyde adhesive and a preparation method thereof, and solves the problem that energy consumption in the adhesion process is high due to high curing temperature of the conventional high-temperature resistant phenol formaldehyde adhesive. The aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive is prepared from phenol, formaldehyde, zinc oxide, aluminic acid and methyl silicone resin. The preparation method comprises the following steps: adding the phenol, formaldehyde and zinc oxide into a reaction kettle, raising the temperature to 97 to 100 DEG C and maintaining the temperature for 1.8 to 2.3 hours; adding the aluminic acid and the methyl silicone resin into the reaction kettle at the temperature of between 97 and 100 DEG C and maintaining the temperature for 4 to 6 hours; distilling and dehydrating under reduced pressure; and when the temperature is between 102 and 108 DEG C, stopping dehydrating, and reducing the temperature to obtain the phenol formaldehyde adhesive. The aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive has the advantages of curing temperature of 150 DEG C, good heat resistance, and water or seawater erosion resistance, and is applied to adhering high-temperature resistant materials, friction materials, metal product parts, composite packaging materials and the like.

Description

technical field [0001] The invention relates to a phenolic resin adhesive and a preparation method thereof. Background technique [0002] Phenolic resin adhesives are widely used in high-tech fields such as aviation, aerospace, weapons, automobiles and electronics because of their excellent chemical resistance, aging resistance, water resistance and electrical insulation, but unmodified phenolic resin adhesives have poor heat resistance , so that its application is limited. Methods to improve the heat resistance of phenolic resin adhesives include: 1. Inorganic acid modification: inorganic acid is phosphoric acid, molybdic acid, tungstic acid, boric acid or titanic acid; 2. Organic modification: organic matter is bismaleimide or organic Silicon; in addition, it can also be modified with POSS. The above methods can obtain high-temperature resistant phenolic resin adhesives. The curing temperature is also correspondingly increased by 30°C to 50°C, so that the curing temperat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/14
Inventor 李冰王勃叶险峰
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI