Al-Si-Cu-Ni alloy state foil-shaped brazing material and preparation method thereof

Abstract

The invention relates to a preparation method of an Al-Si-Cu-Ni alloy state foil-shaped brazing material, which comprises the following steps of: (1) confirming the components of brazing material alloy raw material: weighing a quaternary alloy component comprising about 18-20 percent of Cu, about 5.5-6.5 percent of Si, 2.0-2.4 percent of nickel and the balance of aluminum as a basic component of a low-temperature aluminum brazing material; (2) preparing intermediate alloy, wherein the intermediate alloy needing casting comprises the intermediate alloy of Al-Cu50 and Al-Si30, and the nonvaccum intermediate frequency furnace smelting is adopted in preparation; (3) smelting and casting a brazing material alloy plate; casting an alloy ingot by adopting a nonvaccum intermediate frequency inducing furnace; (4) heating to 400 DEG C in an annealing furnace and preserving the temperature for more than 12 hours to remove cast ingot segregation and tiny defects; (5) hot rolling and coldly rolling for molding. The prepared brazing material has a melting point of 518-538 DEG C, a width larger than 100 mm and a thickness 0.07-0.15 mm.

Description

technical field The invention relates to an aluminum alloy low-melting point four-component solder, in particular to an Al-Si-Cu-Ni alloy foil-shaped solder and a preparation method thereof, belonging to the technical field of aluminum alloy brazing. Background technique The melting point of the existing GB400 aluminum-silicon eutectic solder is as high as 577°C, and the brazing temperature is generally 595-605°C. Excessively high brazing temperature makes many low-melting point aluminum alloys unable to be connected by brazing. Currently, it can be brazed The only aluminum alloys available are pure aluminum, 3A21, and 6063. In addition, too high welding temperature will easily lead to the growth of the base metal grains, affecting the mechanical properties of the structure, and it will also easily cause the base metal to dissolve excessively, resulting in dissolution defects. Adding Cu element to aluminum-silicon solder can greatly reduce the melting point of the solder, ...

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Problems solved by technology

The melt rotation method can usually be made into a thin strip of continuous brazing filler metal with a width of several millimeters and a length of more than ten meters and a uniform structure. The melt quenching and rotating rapid solidification method can keep the roll speed constant during the preparatio

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