Phase-change energy accumulation and temperature control device of sealing equipment

Abstract

The invention provides a phase-change energy accumulation and temperature control device of sealing equipment, comprising a sealing box and a heating component arranged in the box, wherein the surface of the heating component is connected with a phase-change radiator and a phase-change cold plate, and the surface of the phase-change radiator is connected with a slabby semiconductor refrigerator which is communicated with outside by passing through the sealing box. The phase-change energy accumulation cooling device of a sealing electronic device can maintain temperature control capability forthe sealing electronic device working at a severe environmental temperature after a cooling power supply is cut off for a long time, thus being capable of stabilizing working temperature of key components in the sealing electronic equipment in a severe working environment of strong transient thermal shock or cold shock. As the phase-change energy accumulating material has great latent heat of phase change and the semiconductor refrigerator exporting heat out of the sealing box has smaller volume, the device has the advantages of large cooling capability, small volume and low energy consumption as compared with the traditional cooling method. The device can ensure the temperature in the sealing electronic device to be stable and controllable when the working environmental temperature is extremely low.

Description

technical field [0001] The invention relates to a temperature control device for sealed electronic equipment with high heating power under severe working conditions, in particular to a temperature control device for phase change energy storage of the sealed equipment. Background technique [0002] The cooling method of traditional sealed electronic equipment usually uses the cooling medium to transfer the heat generated by the heat-generating device to the atmospheric environment outside the equipment through conduction and convection, so as to realize the temperature control inside the equipment. For some sealed electronic equipment with harsh working environment, when the ambient temperature is high, the heat generated inside is difficult to cool the internal heat-generating components through the above-mentioned traditional methods, so that the temperature of the sealed electronic equipment will gradually increase. After the cooling power supply of the sealed electronic e...

AI Technical Summary

Problems solved by technology

For some sealed electronic equipment with harsh working environment, when the ambient temperature is high, the heat generated inside is difficult to cool the internal heat-generating components through the above-mentioned traditional methods, so that the temperature of the sealed electronic equipment will gradually increase

After the cooling power supply of the sealed electronic equipment with cooling device is cut off, the temperature of the sealed electronic equipment working in a high temperature environment will rise rapidly, thereby shortening the life of the electronic equipment and greatly increasing the failure rate

When the ambient temperature is extremely low, the temperature when starting up is also extremely low, sometimes causing the device to fail to start up

Under the harsh working environment of instantaneous strong thermal shock or cold shock and their alternating effects, it is more likely to cause the failure of key components of electronic equipment and make the equipment unable to work

[0003] For sealed electronic equipment with large heating power, liquid such as water cooling system is generally used. Usually, the water cooling system used must have a large water storage tank, circulating water pump and water pipe, which will make the volume and weight of the entire electronic equipment relatively large. It is not suitable for use in occasions where miniaturization and light weight are required, and a more complicated water cooling system will greatly reduce the reliability of electronic equipment

[0004] At present, semi-conductor refrigeration technology is widely used to solve the problem of miniaturization of cooling system. However, due to the low efficiency of semi-conductor refrigeration, the cooling power is small, and DC power supply is required, it can only be used as refrigeration for electronic equipment with small heat dissipation power.

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