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Conductor material for electronic device and electric wire for wiring using the same

A technology for electronic equipment and conductors, applied in conductors, conductive materials, conductive materials, etc., can solve problems such as increased cost and easy detachment of solder joints

Inactive Publication Date: 2010-09-22
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the alloy wires produced by these methods all have the following disadvantages: the joints between electric wires or the solder joints when used as lead wires are prone to detachment, etc.
If a special melting method (vacuum melting furnace) or powder metallurgy method is used, the cost will increase (for example, refer to Patent Document 5)

Method used

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  • Conductor material for electronic device and electric wire for wiring using the same
  • Conductor material for electronic device and electric wire for wiring using the same
  • Conductor material for electronic device and electric wire for wiring using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Each metal material was melted in a high-frequency melting furnace and an atmospheric melting furnace according to the alloy compositions shown in Tables 1 to 2 below, and billets were cast. Next, the billet was homogenized at 900° C. for 1 hour, then hot extruded, and immediately quenched in water to obtain a round bar (diameter: 20 mm). Next, the round bar was drawn at a low temperature to produce materials with various wire diameters. The wire rods having various wire diameters were subjected to heat treatment under various heat treatment conditions, and then drawn at a low temperature. In addition, samples produced by repeating aging heat treatment and low-temperature wire drawing steps were prepared as needed.

[0054] In addition, what has an alloy composition within the range prescribed|regulated by this invention is an example of this invention, and what has an alloy composition outside the said predetermined range is shown as a comparative example.

[0055] F...

Embodiment 2

[0087]For the material (No.1,14,16,28,30) of the example of the present invention of table 1 and the material (No.101,118) of the comparative example of table 2, according to step (1) in the above-mentioned embodiment 1 respectively Low-temperature wire drawing (cold working) and aging heat treatment were performed on each round bar (20 mm in diameter) to obtain a copper alloy wire (conductor wire) with a diameter of 0.17 mm. According to the usual method, 7 above-mentioned wires are twisted and compressed to make a cross-sectional area of ​​0.13mm 2 twisted thread. The above twisted wire was subjected to an aging heat treatment at 450°C for 2 hours, and then covered with an insulator (polyethylene) to manufacture an electric wire for wiring (prototype material).

[0088] For the produced electric wires, tensile strength (TS, unit: MPa) and electrical conductivity (EC, unit: %LACS) were measured according to the above-mentioned methods. When measuring the tensile strength, t...

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Abstract

Disclosed is a conductor material for electronic devices, which is composed of a copper alloy material consisting of 0.5-3.0% by mass of cobalt, 0.1-1.0% by mass of silicon and the balance of copper and unavoidable impurities. This conductor material for electronic devices may further contain 0.1-3.0% by mass of nickel, one or more elements selected from iron, silver, chromium, zirconium and titanium in an amount of 0.05-1.0% by mass in total, and one or more elements selected from 0.05-0.5% by mass of magnesium, 0.1-2.5% by mass of zinc, 0.1-2.0% by mass of tin, 0.01-0.5% by mass of manganese and 0.01-0.5% by mass of aluminum in an amount of 0.01-3.0% by mass in total.

Description

technical field [0001] The present invention relates to a conductor wire for electronic equipment and an electric wire for wiring using the wire. Background technique [0002] Conventionally, annealed copper wires specified in JIS C3102, or wires obtained by applying tin plating to the above-mentioned annealed copper wires, have been mainly used as electronic equipment applications, automobile wiring wires, and robot wiring materials. Twisting, and then concentrically covering the twisted wire conductor with an insulator such as vinyl chloride / cross-linked polyethylene. [0003] In addition, there is a type that is fitted with a connector (female) in an uncoated state on some electronic devices. Among these types, the annealed copper wire shown above uses an alloy wire having insufficient strength but lower conductivity than pure copper, for example, JIS-C2700W (brass), C5191W (phosphor bronze) or JIS-C1940W (doped Copper with iron), C7025W (Corson alloy copper), C1720W (b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/02C22C9/02C22C9/04C22C9/06C22F1/08H01B5/08C22F1/00
CPCC22C9/06H01B1/026C22C9/10
Inventor 三原邦照高桥功
Owner FURUKAWA ELECTRIC CO LTD