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Low-temperature lead-free packaging slurry for mica capacitor and preparation method thereof

A technology for encapsulating slurry and capacitors, which is applied in the direction of fixed capacitor casing/package, fixed capacitor parts, etc., which can solve the problems of small adhesion, poor matching of mica capacitors, and harmfulness to human body, and achieve good matching effect

Inactive Publication Date: 2010-10-20
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, encapsulation materials are mainly divided into two types: one is lead-containing and the other is lead-free. While these two encapsulation materials have their own advantages, they also have some disadvantages. For example, lead-containing The encapsulant is well matched with mica capacitors, but it is harmful to the human body because it contains lead, and the lead-free encapsulant is harmless to the human body because it does not contain lead, but its match with mica capacitors is poor, especially is less adhesive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 1) Preparation of lead-free glass powder: take 50% Bi by weight percentage 2 o 3 , 16% of B 2 o 3 , 6% SiO 2 , 4% Al 2 o 3 , 7% of K 2 O, 7% Na 2 O, 3% TiO 2 , 3% of V 2 o 5 , and a 4% P 2 o 5 , grind it into powder and pass it through a 60-mesh sieve, mix it evenly in a mixer, put it in a mortar, transfer it to a high-temperature resistance furnace, and keep it warm at 1000 ° C for 3 hours, then take it out and immerse it in cold water Carry out water quenching to obtain glass slag, then put the above-mentioned glass slag into a ball mill and mill it for 4 hours to form glass powder. Finally, pass the ball-ground glass powder through 400 sieves, and then dry to obtain lead-free glass powder for use .

[0025] 2) Preparation of organic vehicle: Weigh 85% terpineol, 6% ethyl cellulose, 4% polydimethylsiloxane as a leveling agent, and 5% polydimethylsiloxane as a defoamer according to weight percentage Tetraethyl orthosilicate was put into a beake...

Embodiment 2

[0028] 1) Preparation of lead-free glass powder: take 53% Bi by weight 2 o 3 , 20% of B 2 o 3 , 5% SiO 2 , 3% Al 2 o 3 , 6% of K 2 O, 5% Na 2 O, 2% TiO 2 , 3% of V 2 o 5 , and a 3% P 2 o 5 , grind it into powder and pass it through a 60-mesh sieve, mix it evenly in a mixer, put it in a mortar, transfer it to a high-temperature resistance furnace, and keep it warm at 1000 ° C for 3 hours, then take it out and immerse it in cold water Carry out water quenching to obtain glass slag, then put the glass slag obtained above into a ball mill and mill for 4 hours to form glass powder, and finally pass the ball-ground glass powder through 400 sieves, and then dry to obtain lead-free glass powder for use.

[0029] 2) Preparation of organic vehicle: Weigh 86% terpineol, 10% ethyl cellulose, 1.5% polymethylphenylsiloxane as a leveling agent, and 2.5% as a defoamer according to weight percentage Put tetraethyl orthosilicate into a beaker, react in a water bath at 90...

Embodiment 3

[0032] 1) Preparation of lead-free glass powder: Weigh 56% Bi 2 o 3 , 18% of B 2 o 3 , 10% SiO 2 , 2% Al 2 o 3 , 4% of K 2 O, 3% Na 2 O, 1% TiO 2 , 5% of V 2 o 5 , and 1% of P 2 o5 , grind it into powder and pass it through a 60-mesh sieve, mix it evenly in a mixer, put it in a mortar, transfer it to a high-temperature resistance furnace, and keep it warm at 1000 ° C for 3 hours, then take it out and immerse it in cold water Carry out water quenching to obtain glass slag, then put the glass slag obtained above into a ball mill and mill for 4 hours to form glass powder, and finally pass the ball-ground glass powder through 400 sieves, and then dry to obtain lead-free glass powder for use.

[0033] 2) Preparation of organic vehicle: Weigh 87% terpineol, 8% ethyl cellulose, 1% organo-modified polysiloxane as a leveling agent, and 4% as a defoamer Tetraethyl orthosilicate was put into a beaker, and reacted in a water bath at 90°C for 3 hours, and when the li...

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Abstract

The invention provides a low-temperature lead-free packaging slurry for mica capacitor and a preparation method thereof. The packaging slurry comprise the components of lead-free glass and an organic carrier, wherein a Bi-B-Si system is adopted in the lead-free glass; the organic carrier consists of an organic solvent and an additive; and a terpineol-ethyl cellulose system is adopted in the organic solvent. The packaging slurry for the mica capacitor of the invention is non-toxic and is perfectly matched with the mica capacitor.

Description

technical field [0001] The invention relates to an encapsulation slurry and a preparation method thereof, in particular to a mica capacitor low-temperature lead-free encapsulation slurry and a preparation method thereof. Background technique [0002] Mica, as an inorganic insulating material and dielectric material, has high dielectric strength, large dielectric constant, low loss, high chemical stability, good heat resistance, and is easy to peel off into thin sheets with uniform thickness. The laminated capacitor makes the capacitor have many excellent properties, for example, the loss is small, roughly below 10~30x4, the capacity is less than or equal to 82pF; the heat resistance is good, and the heat resistance temperature of the mica capacitor can reach 200 ℃; high frequency characteristics Excellent, the highest working frequency of metal-encapsulated capacitors can reach 600mHz; high precision, the highest precision can reach 0.01%; good capacity stabi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/224C08L1/02C08K13/02C08K3/40C08K5/05
Inventor 蒲永平陈小龙赵新
Owner SHAANXI UNIV OF SCI & TECH