Technique for manufacturing high-power light emitting diode (LED) lamp

Abstract

The invention relates to the technical field of techniques for manufacturing light emitting diode (LED) lamps, in particular to a technique for manufacturing a high-power LED lamp. The technique comprises the following steps: die-bonding with fulmargin, welding the wires, sealing the primer, coating a fluorescent powder glue film, sealing finish, and the like, wherein the colloid in each step is dried in a sectional baking mode. After using the technical scheme, a LED chips is fixed with fulmargin, so that the LED chip can emit heat easily; before coating the fluorescent powder glue film, a layer of primer is sealed so as to tile and cover the fluorescent powder glue film on the LED chip, thereby avoiding the wires are damaged when the fluorescent powder is spotted, and isolating the fluorescent powder layer from the LED chip to avoid direct contact and be beneficial to deferring senility; and in addition, the primer, fluorescent powder glue film and finish are baked in a sectional mode, so that all the layers are uniform and can be well combined.

Description

Technical field: [0001] The invention relates to the technical field of manufacturing technology of LED lamps, in particular to a manufacturing technology of high-power LED lamps. Background technique: [0002] Due to its superior energy-saving properties, LED lamps are being used more and more widely. High-power LED lamps have a tendency to replace existing halogen street lamps as street lamps and other large-scale public lighting lamps. Generally speaking, large-scale public lighting requires the use of yellow light with good penetrability, while the existing yellow light LED lights mainly use blue LED chips and phosphors to excite yellow light, so the coating of phosphors It is one of the keys in the manufacturing process of high-power LED lamps. At present, the commonly used coating method is: after the LED chip is soldered with wires, the phosphor is directly coated on the surface of the chip. In this way, the phosphor layer is difficult to coat evenly, and the thickne...

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Problems solved by technology

At present, the commonly used coating method is: after the LED chip is soldered with wires, the phosphor is directly coated on the surface of the chip. In this way, the phosphor layer is difficult to coat evenly, and the thickness is difficult to control, resulting in low luminous efficiency of the LED lamp. The light color is not good; and the Chinese patent application No. 200710124607.0 discloses a phosphor coating process method for high-power LED chips. The powder glue is dotted on the surface of the LED chip, and the fluidity of the dam and the fluorescent powder glue is used to make it evenly coated. Although this method can solve the problem of uniform phosphor powder coating, it is very complicated to operate and has low efficiency. It is easy to damage its wires; in addition, the phosphor powder is directly in contact with the LED chip, which not only affects the heat dissipation and lighting brightness of the LED chip, but also the heat of the LED chip can easily accelerate the aging of the phosphor powder and reduce the effect of the phosphor powder, thereby making high-power Shortened lifespan of LED lamps

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