Diamond wire saw

A diamond wire saw and diamond technology, applied in metal processing equipment, stone processing equipment, grinding machines, etc., can solve the problems that the service life of the diamond wire saw cannot be improved, and the diamond is easy to fall off, so as to achieve normal and durable use, high welding strength, The effect of improving the service life
CN101879696AInactive Publication Date: 2010-11-10厦门致力金刚石工具有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
厦门致力金刚石工具有限公司
Publication Date
2010-11-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a diamond wire saw, which comprises diamond grinding grains, a flaky base, a rubber plastic material layer and a center line positioned in the center of the rubber plastic material layer, wherein the diamond grinding grains are fixed on the flaky base, and the rubber plastic material layer covers all parts on the center line, the flaky base and the diamond grinding grains except cutting surfaces. The diamond wire saw has the advantages of simple manufacture process and low production cost and difficult falling of the diamond grinding grains in the wire saw in the cutting process.
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Description

technical field

[0001] The invention relates to a diamond tool, in particular to a diamond wire saw. Background technique

[0002] As the hardest material, diamond is widely used in the processing of materials, especially the grinding and cutting of non-metallic brittle and hard materials, and is widely used in cutting tools such as diamond wire saws and diamond wire saws. Diamond wire saws are mostly used for crystal cutting, and their diameters are mostly within 1mm. The diamond wire saws used for crystal processing (obtained by depositing very fine diamonds on steel wires by electroplating) have small diameters, small slits, and have the ability to be cut. The material consumption and waste are small. However, because the diamond abrasive particles attached to the wire saw are small, the particle size is mostly below 0.1mm. Therefore, if it is used for stone cutting, the cutting efficiency is very low and cannot meet the requirements of production. need. At present, in ...

Claims

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