Metal heat-conducting substrate and manufacturing method thereof

Abstract

The invention relates to the technical field of electronic packaging and discloses a metal heat-conducting substrate and a manufacturing method thereof. An insulating medium slurry layer is printed on a metal substrate and molten by a laser ablation method to form an insulating medium layer, and a metal circuit slurry layer is printed on the insulating medium layer and molten by the laser ablation method to form a metal circuit layer, so that a well-insulated radiating passage is provided. The laser melting method has the advantages of achieving extremely high pattern accuracy, contributing to product miniaturization and precision, simplifying the technology of a manufacturing process, preventing pollution, saving materials, lowering cost and achieving good radiating effect.

Description

Technical field [0001] The invention relates to the technical field of electronic packaging, and in particular to a metal thermal conductive substrate and a manufacturing method thereof. Background technique [0002] As the junction temperature rises when the LED is working, the probability of light-emitting recombination will decrease, and the lifetime and output luminous flux will also decrease as the temperature rises. If the heat generated by the PN junction can be dissipated as soon as possible, it will not only improve the luminous efficiency of the product, but also improve the reliability and life of the product. The LED chip also has strict requirements for the matching of the linear expansion coefficient of the substrate material. [0003] At present, the most common ceramic substrates on the market are LTCC (Low Temperature Co-fired Ceramic LTCC) or ceramic heat dissipation substrates made of thick film technology. The calibration bottleneck of this type of product manua...

AI Technical Summary

Problems solved by technology

[0003] At present, the more common ceramic substrates on the market are mostly LTCC (Low Temperature Co-fired Ceramic LTCC) or ceramic heat dissipation substrates made of thick film technology. The calibration bottleneck of hand-screen printing technology for this type of product makes it Alignment accuracy cannot be matched with further soldering, such as eutectic or flip-chip packaging

[0004] It is more common in the prior art that epoxy resin is used for the insulating medium layer, and a copper circuit layer is adhered to it; the main problems are: 1. Poor thermal conductivity of epoxy resin; 2. Poor high and low temperature stability of epoxy resin; 3. The high temperature cracking of epoxy resin causes poor reliability, and the connection strength between epoxy resin and copper circuit layer and substrate is not high; 4. The process of manufacturing circuits is complex, polluting, not environmentally friendly, and unnecessary copper circuit layers need to be corroded, waste of copper resources

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