Metal heat-conducting substrate and manufacturing method thereof

A heat-conducting substrate and a technology for manufacturing methods, which are applied in the direction of circuit substrate materials, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problems of poor high and low temperature stability of epoxy resin, poor reliability, and complicated processes, etc., and achieve the expansion of material types, Avoid high temperature sintering and save metal materials

Active Publication Date: 2010-11-24
SHENZHEN UNIV
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Problems solved by technology

[0003] At present, the more common ceramic substrates on the market are mostly LTCC (Low Temperature Co-fired Ceramic LTCC) or ceramic heat dissipation substrates made of thick film technology. The calibration bottleneck of hand-screen printing technology for this type of product makes it Alignment accuracy cannot be matched with further soldering, such as eutectic or flip-chip packaging
[0004] It is more common in the prior art that epoxy resin is used for the insulating medium layer, and a copper cir

Method used

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  • Metal heat-conducting substrate and manufacturing method thereof
  • Metal heat-conducting substrate and manufacturing method thereof
  • Metal heat-conducting substrate and manufacturing method thereof

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[0040] The present invention provides a metal thermally conductive substrate and a manufacturing method thereof. Printing and laser ablation and melting methods are used on metal to manufacture a metal-based ceramic glass mixture insulating film insulating film thermally conductive PCB substrate for power LD, LED and power electronic devices , Sensor packaging, circuit connection, and provide good heat dissipation channels. In order to make the objectives, technical solutions and advantages of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.

[0041] The manufacturing method of a metal thermally conductive substrate of the present invention, such as figure 1 As shown, including the following steps:

[0042] Step 110: Degrea...

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Abstract

The invention relates to the technical field of electronic packaging and discloses a metal heat-conducting substrate and a manufacturing method thereof. An insulating medium slurry layer is printed on a metal substrate and molten by a laser ablation method to form an insulating medium layer, and a metal circuit slurry layer is printed on the insulating medium layer and molten by the laser ablation method to form a metal circuit layer, so that a well-insulated radiating passage is provided. The laser melting method has the advantages of achieving extremely high pattern accuracy, contributing to product miniaturization and precision, simplifying the technology of a manufacturing process, preventing pollution, saving materials, lowering cost and achieving good radiating effect.

Description

Technical field [0001] The invention relates to the technical field of electronic packaging, and in particular to a metal thermal conductive substrate and a manufacturing method thereof. Background technique [0002] As the junction temperature rises when the LED is working, the probability of light-emitting recombination will decrease, and the lifetime and output luminous flux will also decrease as the temperature rises. If the heat generated by the PN junction can be dissipated as soon as possible, it will not only improve the luminous efficiency of the product, but also improve the reliability and life of the product. The LED chip also has strict requirements for the matching of the linear expansion coefficient of the substrate material. [0003] At present, the most common ceramic substrates on the market are LTCC (Low Temperature Co-fired Ceramic LTCC) or ceramic heat dissipation substrates made of thick film technology. The calibration bottleneck of this type of product manua...

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Application Information

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IPC IPC(8): H01L21/48H01L23/498H01L23/34H05K1/05
CPCH01L2224/48091H01L2224/48137H01L2224/73265H01L2924/00014
Inventor 柴广跃刘文王少华黄长统雷云飞刘沛徐光辉
Owner SHENZHEN UNIV
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