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Laminate, method for producing laminate, flexible printed circuit board, and method for manufacturing flexible printed circuit board

A manufacturing method and flexible printing technology, applied in the directions of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of low adhesion between electroless plating films and insulating materials, and the inability to obtain moisture absorption solder heat resistance, etc. To achieve the effect of excellent adhesion and moisture absorption solder heat resistance

Active Publication Date: 2010-11-24
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, when the technical method is applied to a heat-resistant resin material typified by polyimide, since the electroless plating film is formed on the resin in a deposited manner, there is an electroless plating film and an insulating material. The problem of low adhesion and insufficient moisture absorption solder heat resistance

Method used

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  • Laminate, method for producing laminate, flexible printed circuit board, and method for manufacturing flexible printed circuit board
  • Laminate, method for producing laminate, flexible printed circuit board, and method for manufacturing flexible printed circuit board

Examples

Experimental program
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Effect test

Embodiment

[0118] Although the present invention will be more specifically described below based on Examples and Comparative Examples, the present invention is not limited thereto. In addition, the melting point (Tm) and glass transition temperature (Tg) of the thermoplastic polyimide used as the plating-forming layer in Examples and Comparative Examples, the peel strength of the copper-plated layer of the laminate, and the moisture-absorbing solder heat resistance of the laminate properties, measured or evaluated in the following manner.

[0119] 〔The melting point of thermoplastic polyimide〕

[0120] On the polished surface of 18 μm rolled copper foil (BHY-22B-T, manufactured by Nippon Mining Metals Co., Ltd.), the thermoplastic polyimide precursor solution obtained in the synthesis example was flow-cast to a final thickness of 20 μm, and heated at 130° C. Drying was performed for 3 minutes, 2 minutes at 200°C, 2 minutes at 250°C, 2 minutes at 300°C, and 1 minute at 350°C. After dryi...

Synthetic example 1

[0128] (Synthesis example 1: Synthesis of thermoplastic polyimide precursor)

[0129] To a glass flask with a capacity of 2000ml, add N,N-dimethylformamide (hereinafter also referred to as DMF) 637.0g, 3,3',4,4'-biphenyltetracarboxylic dianhydride (hereinafter also referred to as BPDA) 68.2g, while stirring under nitrogen atmosphere, add 1,4-bis(4-aminophenoxy)benzene (hereinafter also referred to as TPE-Q) 20.3g, 1,3-bis(4-aminophenoxy) 45.4 g of oxy)benzene (hereinafter also referred to as TPE-R) was stirred at 25° C. for 1 hour. Separately, a solution obtained by dissolving 2.0 g of TPE-R in 27.0 g of DMF was prepared, and this was slowly added to the reaction solution and stirred while paying attention to the viscosity. When the viscosity reached 1200poise, the addition and stirring were stopped to obtain a polyamic acid solution.

Synthetic example 2

[0130] (Synthesis example 2: Synthesis of thermoplastic polyimide precursor)

[0131] To a glass flask with a capacity of 2000ml, add 637.2g of DMF and 67.8g of BPDA, and add 4,4'-bis(4-aminophenoxy)biphenyl (hereinafter also referred to as 4.2 g of BAPP) and 62.0 g of TPE-R were stirred at 25° C. for 1 hour. Separately, a solution obtained by dissolving 2.0 g of TPE-R in 27.0 g of DMF was prepared, and this was slowly added to the reaction solution and stirred while paying attention to the viscosity. When the viscosity reached 1200poise, the addition and stirring were stopped to obtain a polyamic acid solution.

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Abstract

Disclosed are a laminate and a flexible printed circuit board using the laminate, wherein adhesion between a resin material and a plating layer as well as solder heat resistance after moisture absorption are improved. Specifically disclosed is a method for producing a laminate which is composed of at least a polymer film, a to-be-plated layer containing at least a crystalline thermoplastic resin, and a plating layer. The method for producing a laminate is characterized by comprising (A) a plating step wherein a laminate composed of at least a polymer film, a to-be-plated layer containing at least a crystalline thermoplastic resin and a plating layer is produced by plating a resin material which is composed of at least the polymer film and the to-be-plated layer containing at least a crystalline thermoplastic resin, and (B) a heating step wherein the laminate is heated.

Description

technical field [0001] The invention relates to a laminated board, a method for manufacturing the laminated board, a flexible printed circuit board, and a method for manufacturing the flexible printed circuit board. Background technique [0002] In recent years, electronic equipment continues to develop rapidly toward higher performance, higher functionality, and miniaturization. Along with such development, miniaturization and weight reduction are increasingly required for electronic components used in electronic equipment. In order to meet the above requirements, higher density, higher functionality, and higher performance have been demanded for semiconductor element packaging methods and circuit boards on which these semiconductor elements are mounted. [0003] Generally speaking, a flexible printed circuit board (hereinafter also referred to as FPC) has the following structure: a flexible insulating film is used as a substrate (base film), and a metal foil is bonded to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B15/088H05K1/03H05K3/38
CPCH05K1/0393H05K2201/0141H05K2201/0129H05K3/387H05K1/036H05K2203/1105Y10T428/31504B32B15/08B32B15/20H05K1/03H05K1/0313H05K1/05
Inventor 下大迫宽司菊池刚伊藤卓田中滋
Owner KANEKA CORP