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Cyanogens-free gold plating solution and method for plating gold by adopting same

A technology for electroplating gold and plating solution, applied in the field of plating solution and electroplating, can solve the problems of poor plating solution stability and toxic cyanide plating solution, and achieve the effect of good plating solution stability

Active Publication Date: 2011-09-21
WUXI HAITE NEW MATERIAL RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the cyanide plating solution is poisonous and the sulfite gold plating solution is poor in stability because the sulfite is easily oxidized

Method used

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  • Cyanogens-free gold plating solution and method for plating gold by adopting same
  • Cyanogens-free gold plating solution and method for plating gold by adopting same

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specific Embodiment approach 1

[0012] Specific embodiment one: in the present embodiment, the plating solution of cyanide-free electroplating gold is made up of complexing agent, gold trichloride, potassium carbonate, potassium pyrophosphate and compound additive; In the plating solution of cyanide-free electroplating gold, the The concentration is 40g / L~150g / L, the concentration of gold ion is 4g / L~15g / L, the concentration of potassium carbonate is 60g / L~120g / L, the concentration of potassium pyrophosphate is 30g / L~70g / L, The concentration of the compound additive is 1ml / L-10ml / L; the compound additive is a mixture of rare earth salt, organic matter and surfactant.

[0013] In this embodiment, the ratios between the various components constituting the compound additive are arbitrary.

specific Embodiment approach 2

[0014] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the complexing agent is 5,5-dimethylhydantoin, 3-hydroxymethyl-5,5-dimethylhydantoin Urea or 1,3-dichloro-5,5-dimethylhydantoin. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0015] Embodiment 3: This embodiment is different from Embodiment 1 or Embodiment 2 in that the rare earth salt is cerium nitrate or lanthanum nitrate. Others are the same as those in the first or second embodiment.

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Abstract

The invention provides cyanogens-free gold plating solution and a method for plating gold by adopting the cyanogens-free gold plating solution, relating to a plating solution and a gold electroplating method. The invention solves the problems that cyanide is toxic and the stability of sulphite gold plating solution is poor. The cyanogens-free gold plating solution of the invention is composed of coordinating agent, auric chloride, potassium carbonate, potassium pyrophosphate and compound additive. The gold plating method of the invention includes the following steps: sodium hydroxide is used for regulating the pH value of cyanogens-free gold plating solution, then constant current mode is adopted, and plating is carried out under the conditions that the distance of cathode and anode is 5-20cm and the temperature is 30-60 DEG C. The cyanogens-free gold plating solution of the invention contains no highly toxic substance, and the stability of plating solution is good, the plating solution is not muddy or changed in colour when being used in 30 days (including plating and ingredient compensation). Meanwhile 10mL plating solution is used for continuous plating and 0.15Ah of electric quantity passes through, and a coating in good surface state still can be obtained.

Description

technical field [0001] The invention relates to a plating solution and an electroplating method. Background technique [0002] Since the development of precious metal plating, it has developed rapidly. Gold plating has excellent corrosion resistance, good ductility, brazing, electrical conductivity and thermal conductivity, and has stable chemical properties and good anti-discoloration ability. Therefore, the electroplating process has been widely used in electrical appliances, printed circuit boards and other electronic products. Component manufacturing, defense technology and finishing. At present, the earliest and most widely used electroplating technology is cyanide electroplating. The cyanide gold plating solution is mainly composed of gold cyanide complex salt and free cyanide. The plating solution has good dispersion and coverage capabilities, high current efficiency, good stability, and fine crystallization of the coating. [0003] With the development of society,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/48
Inventor 安茂忠杨培霞张锦秋杨潇薇冯慧峤
Owner WUXI HAITE NEW MATERIAL RES INST
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