Resin with low surface energy and preparation method thereof

A low surface energy, resin technology, applied in the field of low surface energy resin and its preparation, can solve the problems of application influence, increase of surface energy of modified resin, decrease of contact angle, etc., to achieve compact surface structure, complete curing reaction, surface energy reduced effect

Active Publication Date: 2010-12-15
SHANGHAI HUILI PAINT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the general silicone resin has poor adhesion to the substrate and low bonding strength, which limits its application in the fields of ship antifouling coatings and other fields.
The modification of silicone resin with synthetic resin can improve its adhesion, but generally the surface energy of modified resin will increase and the contact angle will decrease, which will affect its application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] a. Dissolve 10 parts of epoxy resin E-44 in 15 parts of cyclohexanone, and dissolve 1.0 parts of catalyst zinc naphthenate in 5 parts of cyclohexanone;

[0029] b. Add the above epoxy resin solution and 1.0 part of KH560 into 120 parts of methyl silicone resin, stir and mix evenly, add the above catalyst solution, heat until the reaction system boils and reflux, and keep warm at the reflux temperature for 2 hours;

[0030] c. First, stir and dehydrate at a vacuum of 500mmHg for 2 hours, then stir and dehydrate at a vacuum of 600mmHg for 1 hour, and add 40 parts of toluene to obtain an epoxy-modified silicone resin;

[0031] d. Mix 100 parts of the above-mentioned epoxy-modified silicone resin with 2.0 parts of γ-aminopropyltriethoxysilane and 0.5 parts of ethyl orthosilicate, stir evenly, and cure at room temperature.

Embodiment 2

[0033] a. Dissolve 5 parts of epoxy resin E-20 in 7 parts of cyclohexanone, and dissolve 0.5 parts of catalyst zinc isooctanoate in 3 parts of cyclohexanone;

[0034] b. Add the above epoxy resin solution and 0.5 part of KH560 into 100 parts of methylphenyl silicone resin, stir and mix evenly, add the above catalyst solution, heat until the reaction system boils and reflux, and keep warm at the reflux temperature for 1 hour;

[0035] c. Stir and dehydrate at a vacuum degree of 500mmHg for 1 hour, then stir and dehydrate at a vacuum degree of 600mmHg for 2 hours, and add 20 parts of toluene to obtain an epoxy-modified silicone resin;

[0036] d. Mix 100 parts of the above-mentioned epoxy-modified silicone resin with 1.5 parts of γ-aminopropyltriethoxysilane and 1.0 parts of ethyl orthosilicate, stir evenly, and cure at room temperature.

Embodiment 3

[0038] a. Dissolve 2 parts of epoxy resin E-20, 5 parts of epoxy resin E-44 in 11 parts of cyclohexanone, and dissolve 0.7 parts of catalyst zinc naphthenate in 4 parts of cyclohexanone;

[0039] b. Add the above epoxy resin solution and 0.7 part of KH560 into 90 parts of methyl silicone resin and 20 parts of methyl phenyl silicone resin, stir and mix evenly, add the above catalyst solution, heat until the reaction system boils and refluxes, Incubate at reflux temperature for 1.5 hours;

[0040] c. First, stir and dehydrate under a vacuum of 500mmHg for 1.5 hours, then stir and dehydrate under a vacuum of 600mmHg for 1.5 hours, and add 30 parts of toluene to obtain an epoxy-modified silicone resin;

[0041] d. Mix 100 parts of the above-mentioned epoxy-modified silicone resin with 1.0 parts of γ-aminopropyltriethoxysilane and 1.5 parts of ethyl orthosilicate, stir evenly, and cure at room temperature.

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PUM

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Abstract

The invention discloses resin with low surface energy and a preparation method thereof. The resin with low surface energy is prepared from the following raw materials in parts by weight: 100-120 parts of organic silicon resin, 5-10 parts of epoxy resin, 0.5-1.0 part of coupler KH560, 0.5-1.0 part of catalyst, 10-20 parts of cyclohexanone and 20-40 parts of toluol. The preparation method comprises the following three steps of: dissolving the epoxy resin and the catalyst, carrying out a heating reaction and dewatering under reduced pressure to finally obtain the resin with low surface energy. Under the action of the coupler and the catalyst, the invention effectively grafts the epoxy resin onto the silicon resin to form composite resin. Detected according to a GB 1720-79 (89) paint film adhesion force measuring method and a sessile drop method contact angle measuring method, the resin solidified by gamma-aminopropyl triethoxysilane and ethyl orthosilicate reaches the second level of the adhesion force and a contact angle of 112 degrees while corresponding pure silicon resin reaches the fourth level of the adhesion force and a contact angle of 96 degrees.

Description

technical field [0001] The invention relates to a low surface energy resin and a preparation method thereof, more specifically to an epoxy-modified silicone resin and a preparation method thereof. Background technique [0002] Silicone resin is hydrophobic, its surface tension is small, its surface energy is low, and its contact angle is large. It is widely used in waterproof and antifouling projects. However, the general silicone resin has poor adhesion to the substrate and low bonding strength, which limits its application in the fields of ship antifouling coatings and the like. The modification of silicone resin with synthetic resin can improve its adhesion, but generally the surface energy of modified resin will increase and the contact angle will decrease, which will affect its application. Contents of the invention [0003] The first technical problem to be solved by the present invention is to provide a low surface energy resin, that is, epoxy-modified silicone re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/00C08L83/00C08K5/544C08K5/5415
Inventor 吴蓁何辛王立伟宋琼陈少彪沈丽亚孙揭阳
Owner SHANGHAI HUILI PAINT
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