Resin with low surface energy and preparation method thereof
A low surface energy, resin technology, applied in the field of low surface energy resin and its preparation, can solve the problems of application influence, increase of surface energy of modified resin, decrease of contact angle, etc., to achieve compact surface structure, complete curing reaction, surface energy reduced effect
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Embodiment 1
[0028] a. Dissolve 10 parts of epoxy resin E-44 in 15 parts of cyclohexanone, and dissolve 1.0 parts of catalyst zinc naphthenate in 5 parts of cyclohexanone;
[0029] b. Add the above epoxy resin solution and 1.0 part of KH560 into 120 parts of methyl silicone resin, stir and mix evenly, add the above catalyst solution, heat until the reaction system boils and reflux, and keep warm at the reflux temperature for 2 hours;
[0030] c. First, stir and dehydrate at a vacuum of 500mmHg for 2 hours, then stir and dehydrate at a vacuum of 600mmHg for 1 hour, and add 40 parts of toluene to obtain an epoxy-modified silicone resin;
[0031] d. Mix 100 parts of the above-mentioned epoxy-modified silicone resin with 2.0 parts of γ-aminopropyltriethoxysilane and 0.5 parts of ethyl orthosilicate, stir evenly, and cure at room temperature.
Embodiment 2
[0033] a. Dissolve 5 parts of epoxy resin E-20 in 7 parts of cyclohexanone, and dissolve 0.5 parts of catalyst zinc isooctanoate in 3 parts of cyclohexanone;
[0034] b. Add the above epoxy resin solution and 0.5 part of KH560 into 100 parts of methylphenyl silicone resin, stir and mix evenly, add the above catalyst solution, heat until the reaction system boils and reflux, and keep warm at the reflux temperature for 1 hour;
[0035] c. Stir and dehydrate at a vacuum degree of 500mmHg for 1 hour, then stir and dehydrate at a vacuum degree of 600mmHg for 2 hours, and add 20 parts of toluene to obtain an epoxy-modified silicone resin;
[0036] d. Mix 100 parts of the above-mentioned epoxy-modified silicone resin with 1.5 parts of γ-aminopropyltriethoxysilane and 1.0 parts of ethyl orthosilicate, stir evenly, and cure at room temperature.
Embodiment 3
[0038] a. Dissolve 2 parts of epoxy resin E-20, 5 parts of epoxy resin E-44 in 11 parts of cyclohexanone, and dissolve 0.7 parts of catalyst zinc naphthenate in 4 parts of cyclohexanone;
[0039] b. Add the above epoxy resin solution and 0.7 part of KH560 into 90 parts of methyl silicone resin and 20 parts of methyl phenyl silicone resin, stir and mix evenly, add the above catalyst solution, heat until the reaction system boils and refluxes, Incubate at reflux temperature for 1.5 hours;
[0040] c. First, stir and dehydrate under a vacuum of 500mmHg for 1.5 hours, then stir and dehydrate under a vacuum of 600mmHg for 1.5 hours, and add 30 parts of toluene to obtain an epoxy-modified silicone resin;
[0041] d. Mix 100 parts of the above-mentioned epoxy-modified silicone resin with 1.0 parts of γ-aminopropyltriethoxysilane and 1.5 parts of ethyl orthosilicate, stir evenly, and cure at room temperature.
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