Manufacture method of single-sided flexible circuit board

Abstract

The invention relates to a manufacture method of a single-sided flexible circuit board. The method comprises the following steps of: baiting; then, making a circuit and a laser alignment cross target on a copper foil layer of an S-CCL (Single-sided Copper Clad Laminate); attaching a cover film drilled with cover film alignment holes and other auxiliary holes onto the circuit surface to laminate and solidify; adopting laser to cut a bottom substrate opening at a copper-exposed part on a substrate layer of the S-CCL; then, removing residues of the copper-exposed part through plasma treatment; and finally obtaining a single-sided flexible circuit board through the processes of surface treatment, surface coating, electrical measurement, punching and molding. The finger region substrate can be fully removed through laser cutting to avoid the influence of an overflowing adhesive of the cover film on golden fingers; since the accuracy of laser cutting and alignment is high, the accuracy of the opening size of the bottom substrate is improved so as to ensure the welding and splicing areas of the golden fingers; in addition, since the golden fingers ar protected by the surrounding substrate, the antistripping strength of the golden fingers is improved so as to improve the manufacture yield rate of the single-sided flexible circuit board product.

Description

technical field [0001] The invention relates to a flexible circuit board, in particular to a method for manufacturing a single-sided flexible circuit board. Background technique [0002] The flexible circuit board has the characteristics of lightness, thinness and high flexibility, and is widely used in various electronic products, especially the single-sided flexible circuit board has the characteristics of high flexibility. Therefore, the single-sided flexible circuit board needs to bend the circuit board is of particular importance in specific workplaces. With the continuous development of electronic products, higher and higher requirements are put forward for single-sided flexible circuit boards. For example, the current market requires electronic products to have better reliability and longer service life. The single-sided flexible circuit board used in the application can have stronger soldering and plugging capabilities under the premise of ensuring good performance....

AI Technical Summary

Problems solved by technology

[0004] However, when the cover film glue layer 2 of this conventional single-sided flexible circuit board is laminated at the incision, there will be overflow glue 5 and the overflow glue 5 is irregular, so that the welding and plugging area of ​​the gold fingers is reduced and affects the gold. The surface coating of the finger; only one end of the gold finger is pressed by the cover film, and the gold finger may peel off the base material during welding; the opening of the cover film is generally made by punching, cutting the film, etc., and its dimensional accuracy is not very high; When laminating the cover film, manual and jig alignment are generally used, and the alignment accuracy is not very high, which will affect the production yield of the product

Images