Heat-dissipation paint for light-emitting diode (LED) lamp

A heat-dissipating coating and LED lamp technology, applied in the field of coatings, can solve the problems of poor temperature resistance and aging resistance, low bonding force of substrates, inconvenient construction, etc., and achieve stable mechanical properties, high bonding force, and good heat dissipation effect Effect

Inactive Publication Date: 2011-01-12

JIANGSU UNIV OF SCI & TECH

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AI-Extracted Technical Summary

Problems solved by technology

At present, thermal conductive adhesive is used to solve the heat dissipation problem of LED lamps, but the materials used have relatively poor temperature resistance and aging resi...

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Abstract

The invention discloses heat-dissipation paint for an LED lamp, which is characterized by comprising the following components in percentage by mass: 30 to 50 percent of organosilicon polyurethane prepolymer, 10 to 20 percent of mixed solvent, 1 to 5 percent of silane coupling agent KH560, 8 to 15 percent of beryllium oxide, 15 to 50 percent of aluminium nitride and 1 to 5 percent of oleinic acid. A preparation method comprises the following steps of: firstly, uniformly blending the liquid components; secondly, adding solid components and uniformly stirring; and finally, grinding on a grinder and then packaging. The heat-dissipation paint for the LED lamp in the invention has the advantages of temperature resistance, aging resistance, high adhesion and good heat-dissipation effect.

Application Domain

Point-like light sourceLighting heating/cooling arrangements +1

Technology Topic

PrepolymerSilane coupling +9

Image

Examples

Experimental program(6)

Example Embodiment

[0011] Example 1:

[0012] 1. According to the percentage of mass content ratio:

[0013] 30% silicone polyurethane prepolymer,

[0014] 20% mixed solvent,

[0015] Silane coupling agent KH560 5%,

[0016] Beryllium oxide 15%,

[0017] Aluminum nitride, 29%,

[0018] Oleic acid 1%.

[0019] 2. Preparation method:

[0020] Mix organosilicon modified polyurethane prepolymer, mixed solvent, silane coupling agent KH%560, beryllium oxide, aluminum nitride and oleic acid and stir evenly in the reactor. When grinding to 5-10μm; stop grinding and pack .

[0021] During construction, the heat-dissipating paint is sprayed and dried at a high temperature of 200 degrees for 1 hour to form a film to form a 25-50μmLE heat-dissipating coating.

[0022] 3. Effect of the embodiment:

[0023] Artificial accelerated aging test under 80℃ and 300W ultraviolet light irradiation conditions, the aging time is 4800 hours, the temperature resistance is 250 degrees, the bonding shear force is 16MPa., the thermal conductivity is 250W/(m·K).

Example Embodiment

[0024] Example 2:

[0025] 1. According to the percentage of mass content ratio:

[0026] Silicone polyurethane prepolymer 50%,

[0027] 10% mixed solvent,

[0028] Silane coupling agent KH560 1%,

[0029] Beryllium oxide 10%,

[0030] Aluminum nitride, 24%,

[0031] Oleic acid 5%.

[0032] 2. Preparation method:

[0033] The preparation method is the same as in Example 1.

[0034] 3. Effects of this embodiment:

[0035] Artificial accelerated aging test under 80℃ and 300W ultraviolet light irradiation conditions, the aging time is 4800 hours, the temperature resistance is 250 degrees, the bonding shear force is 19MPa., the thermal conductivity is 268W/(m·K).

[0036]

Example Embodiment

[0037] Example 3:

[0038] 1. According to the percentage of mass content ratio:

[0039] Silicone polyurethane prepolymer 40%,

[0040] 10% mixed solvent,

[0041] Silane coupling agent KH560 2%,

[0042] Beryllium oxide 9%,

[0043] Aluminum nitride, 38%,

[0044] Oleic acid 1%.

[0045] 2. Preparation method:

[0046] The preparation method is the same as in Example 1.

[0047] 3. Effects of this embodiment:

[0048] Artificial accelerated aging test under the conditions of 80℃ and 300W ultraviolet light irradiation, the aging time is 4850 hours, the temperature resistance is 250 degrees, the bonding shear force is 20MPa., the thermal conductivity is 290W/(m·K).

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PUM

Property	Measurement	Unit
Bond shear	16.0	MPa
Thermal conductivity	250.0	W/K/m
Bond shear	19.0	MPa
tensile		MPa
Particle size		Pa
strength	10

Description & Claims & Application Information

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AI-Extracted Technical Summary

Problems solved by technology

Abstract

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Examples

Example Embodiment

Example Embodiment

Example Embodiment

PUM

Description & Claims & Application Information

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