Heat-dissipation paint for light-emitting diode (LED) lamp

A heat-dissipating coating and LED lamp technology, applied in the field of coatings, can solve the problems of poor temperature resistance and aging resistance, low bonding force of substrates, inconvenient construction, etc., and achieve stable mechanical properties, high bonding force, and good heat dissipation effect Effect

Inactive Publication Date: 2011-01-12
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, thermal conductive adhesive is used to solve the heat dissipation problem of LED lamps, but the materials used have relatively poor temperature resistance and aging resi

Method used

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  • Heat-dissipation paint for light-emitting diode (LED) lamp
  • Heat-dissipation paint for light-emitting diode (LED) lamp

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0011] Example 1:

[0012] 1. According to the percentage of mass content ratio:

[0013] 30% silicone polyurethane prepolymer,

[0014] 20% mixed solvent,

[0015] Silane coupling agent KH560 5%,

[0016] Beryllium oxide 15%,

[0017] Aluminum nitride, 29%,

[0018] Oleic acid 1%.

[0019] 2. Preparation method:

[0020] Mix organosilicon modified polyurethane prepolymer, mixed solvent, silane coupling agent KH%560, beryllium oxide, aluminum nitride and oleic acid and stir evenly in the reactor. When grinding to 5-10μm; stop grinding and pack .

[0021] During construction, the heat-dissipating paint is sprayed and dried at a high temperature of 200 degrees for 1 hour to form a film to form a 25-50μmLE heat-dissipating coating.

[0022] 3. Effect of the embodiment:

[0023] Artificial accelerated aging test under 80℃ and 300W ultraviolet light irradiation conditions, the aging time is 4800 hours, the temperature resistance is 250 degrees, the bonding shear force is 16MPa., the thermal co...

Example Embodiment

[0024] Example 2:

[0025] 1. According to the percentage of mass content ratio:

[0026] Silicone polyurethane prepolymer 50%,

[0027] 10% mixed solvent,

[0028] Silane coupling agent KH560 1%,

[0029] Beryllium oxide 10%,

[0030] Aluminum nitride, 24%,

[0031] Oleic acid 5%.

[0032] 2. Preparation method:

[0033] The preparation method is the same as in Example 1.

[0034] 3. Effects of this embodiment:

[0035] Artificial accelerated aging test under 80℃ and 300W ultraviolet light irradiation conditions, the aging time is 4800 hours, the temperature resistance is 250 degrees, the bonding shear force is 19MPa., the thermal conductivity is 268W / (m·K).

[0036]

Example Embodiment

[0037] Example 3:

[0038] 1. According to the percentage of mass content ratio:

[0039] Silicone polyurethane prepolymer 40%,

[0040] 10% mixed solvent,

[0041] Silane coupling agent KH560 2%,

[0042] Beryllium oxide 9%,

[0043] Aluminum nitride, 38%,

[0044] Oleic acid 1%.

[0045] 2. Preparation method:

[0046] The preparation method is the same as in Example 1.

[0047] 3. Effects of this embodiment:

[0048] Artificial accelerated aging test under the conditions of 80℃ and 300W ultraviolet light irradiation, the aging time is 4850 hours, the temperature resistance is 250 degrees, the bonding shear force is 20MPa., the thermal conductivity is 290W / (m·K).

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Abstract

The invention discloses heat-dissipation paint for an LED lamp, which is characterized by comprising the following components in percentage by mass: 30 to 50 percent of organosilicon polyurethane prepolymer, 10 to 20 percent of mixed solvent, 1 to 5 percent of silane coupling agent KH560, 8 to 15 percent of beryllium oxide, 15 to 50 percent of aluminium nitride and 1 to 5 percent of oleinic acid. A preparation method comprises the following steps of: firstly, uniformly blending the liquid components; secondly, adding solid components and uniformly stirring; and finally, grinding on a grinder and then packaging. The heat-dissipation paint for the LED lamp in the invention has the advantages of temperature resistance, aging resistance, high adhesion and good heat-dissipation effect.

Description

technical field [0001] The invention belongs to the technical field of coatings, and relates to a heat dissipation coating, more specifically, to a heat dissipation coating for LED lamps. Background technique [0002] With the rapid expansion of the use range of LED lamps, prolonging the service life of LED lamps has become an urgent problem to be solved. At present, thermal conductive adhesive is used to solve the heat dissipation problem of LED lamps, but the materials used have poor temperature resistance and aging resistance, low adhesion to the base material, poor heat dissipation effect and inconvenient construction. It is difficult to meet people's expectations for LED lamps. cooling requirements. Contents of the invention [0003] The object of the present invention is to solve the above-mentioned problems and overcome the existing defects, and provide a heat-dissipating coating for LED lamps with high adhesion, aging resistance and high heat dissipation coefficie...

Claims

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Application Information

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IPC IPC(8): C09D175/04C09D7/12C09D5/00F21V29/00F21Y101/02F21V29/87
Inventor 高延敏毛慧文
Owner JIANGSU UNIV OF SCI & TECH
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