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Light-weight lattice laminboard and method for preparing laminboard by punching adopting wire-electrode cutting

A wire cutting, sandwich panel technology, applied in the direction of sheet/board, building components, layered products, etc., can solve the problems of poor structural performance of sandwich panels, unsuitable for mass production, etc., to improve structural performance, reduce weight, The effect of improving processing efficiency

Inactive Publication Date: 2012-12-12
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The object of the present invention is to solve the problem that the sandwich panel formed by the traditional method has poor structural performance and is not suitable for mass production due to technical problems, and provides a light-weight lattice sandwich panel and a method for preparing the panel by wire cutting and punching method

Method used

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  • Light-weight lattice laminboard and method for preparing laminboard by punching adopting wire-electrode cutting
  • Light-weight lattice laminboard and method for preparing laminboard by punching adopting wire-electrode cutting
  • Light-weight lattice laminboard and method for preparing laminboard by punching adopting wire-electrode cutting

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specific Embodiment approach 1

[0063] Specific implementation mode one: the following combination Figure 9 Describe this embodiment, this embodiment is a kind of lightweight lattice sandwich panel, it comprises the corrugated plate 1 with hole, upper panel 2 and lower panel 3, the upper top surface of corrugated plate 1 with hole is fixed with upper panel 2 Together, the lower bottom surface of the perforated corrugated plate 1 and the lower panel 3 are fixed together, and a row of through holes is distributed on each inclined side of the perforated corrugated plate 1 . The through holes may be uniformly or unevenly distributed on the inclined side, which is determined according to actual needs.

specific Embodiment approach 2

[0064] Specific implementation mode two: the following combination Figure 1 to Figure 5 , Figure 9 , Figure 10 , Figure 12 to Figure 17 Describe this embodiment, this embodiment adopts the method for preparing the lightweight lattice sandwich panel described in Embodiment 1 by wire cutting and punching, which includes the following steps:

[0065] Step 1. Fix the corrugated board with the upper and lower panels together as the workpiece to be processed, and mark the drilling position on the corrugated board;

[0066] Step 2: Clamp and fix the workpiece to be processed on the fixture of the EDM console, install the electrode on the automatic feed adjustment device, and the electrode feed direction is parallel to the upper panel and perpendicular to the corrugated board. The electrode is connected to one power output end of the spark pulse power supply, the corrugated plate is connected to the other power output end of the spark pulse power supply, and the corrugated plat...

specific Embodiment approach 3

[0088] Embodiment 3: The difference between this embodiment and Embodiment 2 is that the process parameters of electric discharge machining are: pulse width is 6μs-10μs, pulse-to-pulse is 15μs-25μs, peak current is 3A-8A, and machining voltage is 100V ~ 160V, the feed speed of the automatic feed adjustment device is 2μm / s ~ 5μm / s, and the height of the knife is 1 ~ 5mm;

[0089] The process parameters of wire cutting are: processing current is 2A~10A, pulse width is 30μs~80μs, pulse interval is 60μs~150μs, wire speed is 0.8mm / s~3mm / s, frequency conversion is 70V.F~120V.F, Other structures and connection methods are the same as those in Embodiment 2.

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Abstract

The invention discloses a light-weight lattice laminboard and a method for preparing the laminboard by punching by adopting wire-electrode cutting, and belongs to the field of machining. The method solves the problems of poor structural performance of the laminboard molded by a conventional method and the unsuitability for batch production caused by a process problem thereof. In the light-weight lattice laminboard of the invention, the top surface of a corrugated plate with holes is fixed with an upper panel; the bottom surface of the corrugated plate with the holes is fixed with a lower panel; and each inclined side surface of the corrugated plate with the holes is provided with a row of through holes. The method for preparing the light-weight lattice laminboard by punching by adopting the wire-electrode cutting comprises the following steps of: firstly, fixing the corrugated plate with the upper panel and the lower panel; secondly, punching round through holes on the corrugated plate by adopting electric spark; and finally, finishing preparing the light-weight lattice laminboard by punching by adopting the wire-electrode cutting according to a set program. Or the light-weight lattice laminboard is prepared by the following steps of: punching fine round holes in the horizontal or vertical direction of the inclined side surfaces of the corrugated plate by adopting the electricspark; punching by adopting the wire-electrode cutting; and fixing the corrugated plate with the upper panel and the lower panel.

Description

technical field [0001] The invention relates to a lightweight lattice sandwich panel and a method for preparing the panel by wire cutting and drilling, and belongs to the field of mechanical processing. Background technique [0002] At present, there are mainly two kinds of light-weight lattice sandwich panels: rolling method and investment casting method for lattice sandwich panels made of metal materials; mainly two methods for lattice sandwich panels made of fiber reinforced composite materials. There are mold hot pressing method, mold assembly method, fiber weaving method and mechanical assembly method. Analyze the existing problems in the following [0003] Rolling method: Due to the elastic deformation of the metal material during the rolling process, the nodes of the lattice core are often not on the same plane, and the node area of ​​the lattice structure prepared by the rolling method is relatively small. [0004] Investment casting method: Since the metal fluidit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B3/28B23H5/00F16S1/04
Inventor 吴林志熊健马力赵望安齐学飞
Owner HARBIN INST OF TECH
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