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Four-ring precision position control and force control method

A control method and loop control technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as system disturbance or impact, integration of position control and force control, and influence on wire bonding quality, etc. Smooth switching, good force control effect, high positioning accuracy effect

Inactive Publication Date: 2011-02-09
比锐精密设备(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the switching process, the system will only have a current loop controller at a certain moment, that is, the system is in an open-loop uncontrolled stage, which will bring great disturbance or impact to the system, thus affecting the wire bonding. the quality of
At present, there is no control method that integrates position control and force control into a loop in the chip packaging industry at home and abroad.

Method used

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  • Four-ring precision position control and force control method
  • Four-ring precision position control and force control method
  • Four-ring precision position control and force control method

Examples

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Embodiment Construction

[0015] figure 1 It represents the welding process of the LED gold wire welding machine, where the position control section includes: high-speed descent section 1, first search section 2, line arc forming section 4, second search section 5, line cutting section 7 and high-speed rise Section 8; the force control section includes: the first welding section 3 and the second welding section. figure 2 It represents the switching process of the main axis Z-axis where force control occurs from position control to force control. as figure 2 As shown in , the system descends at a low speed from the initial accelerated descent to the specified altitude, and this section is also called the search segment. When the rivet does not collide with the welding lamp cup, the system is always in the position control stage. When the chopper collides with the welding lamp cup and the force sensor detects that the signal is greater than a given value, the system switches from position control to...

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PUM

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Abstract

The invention discloses a four-ring precision position control and force control method applied to a metal wire bonding machine. A position control framework comprises a position ring, a speed ring, a force ring and a current ring; the force control comprises a force ring and a current ring, wherein the force ring is embedded between the position ring and the speed ring so as to guarantee high-enough response speed. A position ring controller consists of a proportional controller, a speed feedforward controller and an acceleration feedforward controller; a current controller consists of a proportional-integral controller; a force ring controller consists of a proportional-integral controller and a speed damper; and a current ring controller consists of a proportional-integral controller. The control framework guarantees smooth switching from the position control to the force control, eliminates impact and vibration brought by switching and guarantees the wire bonding quality.

Description

[technical field] [0001] The invention relates to a four-ring precision position control and force control method applied to an LED gold wire bonding machine. [Background technique] [0002] The gold wire bonding machine is the equipment that completes the wire bonding process in microelectronic packaging. With the gradual development of the semiconductor industry, the market demand for various chips is also increasing, and higher requirements are put forward for the speed and quality of bonding wires. In the process of welding wire, it is required to ensure high precision in every step, which requires high positioning accuracy in the control process. In addition, the control of welding force also determines the quality of welding wire. [0003] Electronic packaging is the process of cutting the chip from the wafer, installing it on the lead frame, and connecting the bare chip and the circuit of the lead frame or substrate with wires or bumps, and then packaging an insulati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L21/60
CPCH01L2224/78301H01L24/78H01L2224/45H01L2224/451H01L2224/78H01L2924/00014H01L2224/48H01L2924/00H01L2924/00012
Inventor 姜海蓉闵建君禹新路程炜
Owner 比锐精密设备(深圳)有限公司