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Organic copper solderability preservative having selective film forming function and use method thereof

An organic copper and selective technology, applied in welding media, manufacturing tools, welding equipment, etc., can solve problems such as affecting production efficiency, time-consuming and laborious, discoloration of gold surface, etc., achieving fast production efficiency, simple and environmentally friendly process, and low cost. Effect

Active Publication Date: 2011-03-02
SHENZHEN CHENGGONG CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when producing mixed gold boards, the gold surface will change color
At present, when producing gold finger boards, the solution is to paste the blue glue on the gold surface first, and then tear off the blue glue after the OSP is over to protect the gold surface from discoloration. This is time-consuming and laborious, and seriously affects the Productivity
Glue is only suitable for mixed gold boards with gold fingers, such as IC carrier boards (BGA), and selective boards (copper / gold mixed) are not feasible at all. Only gold plating is used for surface treatment, which greatly increases the cost. cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] An organic copper flux with selective film formation, its composition is: arylphenyl imidazole 1g / L, formic acid 10ml / L, acetic acid 100ml / L, thiourea 1g / L, zinc acetate 2g according to the mass ratio / L, ethanolamine 1ml / L, citric acid 5g / L.

[0059] An organic copper flux with selective film formation obtained by the above ratio, when the operating temperature is 42°C and the pH value is 4.0, the filming time is 90S, the film thickness is 0.15um, and the appearance presents a film Uniform, no discoloration on the gold surface.

Embodiment 2

[0061] An organic copper flux with selective film formation, its composition is: arylphenyl imidazole 4g / L, formic acid 20ml / L, acetic acid 200ml / L, thiourea 2g / L, zinc acetate 4g according to the mass ratio / L, ethanolamine 3ml / L, citric acid 12g / L.

[0062] An organic copper flux with selective film formation obtained by the above ratio, when the operating temperature is 42°C and the pH value is 4.0, the filming time is 90S, the film thickness is 0.2um, and the appearance presents a film Uniform, no discoloration on the gold surface.

Embodiment 3

[0064] An organic copper flux with selective film formation, its composition is: arylphenyl imidazole 8g / L, formic acid 100ml / L, acetic acid 500ml / L, thiourea 4g / L, zinc acetate 6g according to the mass ratio / L, ethanolamine 6ml / L, citric acid 18g / L.

[0065] An organic copper flux with selective film formation obtained by the above ratio, when the operating temperature is 42°C and the pH value is 4.0, the filming time is 90S, the film thickness is 0.25um, and the appearance presents a film Uniform, no discoloration on the gold surface.

[0066] According to the above-mentioned organic copper flux with selective film formation, it is also characterized in that the mass ratio of each component is:

[0067] Formic acid 25-40ML / L Acetic acid 180-300ML / L Arylphenyl imidazole 1-6g / L

[0068] Thiourea 1-6g / L Zinc acetate 2-6g / L Ethanolamine 1-6ml / L

[0069] Citric acid 5-18g / L.

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Abstract

The invention discloses an organic copper solderability preservative having a selective film forming function and a use method thereof. The organic copper solderability preservative is a composite solution prepared from 10-100ML / L of formic acid, 100-500ML / L of acetic acid, 1-8g / L of imidazole organic matter, 1-6g / L of thiourea, 2-8g / L of zinc acetate, 1-10ml / L of ethanolamine, and 5-20g / L of citric acid. The use method has the following steps: performing oil removal and mircoetching on printed circuit boards (PCBs) and then carrying out film forming on the PCBs in the organic copper solderability preservative for 90-120s and controlling film thickness within 0.15-0.25mu m. The organic copper solderability preservative of the invention can be directly utilized to manufacture C support plates and chemically selective plates; in addition, gold surfaces of the two kinds of plates do not discolour, can maintain initial property and are free from influence of the organic copper solderability preservative; the organic film can resist high temperature for 5 times and features good weldability, fast production efficiency, low cost, simple and environment-friendly preparation, easy treatment of waste water and fine solderability.

Description

【Technical field】 [0001] The present invention relates to the surface treatment technology of printed circuit boards, in particular to a method to realize that when copper and gold coexist on the surface of bare copper or copper / gold mixed printed circuit boards, the organic film will not be deposited on the gold surface, but A selective film-forming organic copper soldering flux selectively deposited on a copper surface and its application method. 【Background technique】 [0002] At present, electronic products are developing toward lightness, thinness, shortness, miniaturization, and multi-function. At the same time, printed circuit boards are also developing toward high precision, thinning, multilayering, and small holes, especially the rapid development of SMT. As a result, SMT uses high-density thin boards (such as IC cards, mobile phones, notebook computers, tuners and other printed boards) to continue to develop, and in the SMT process, only the IMC formed by the combi...

Claims

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Application Information

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IPC IPC(8): B23K35/36H05K3/00
Inventor 谢远秋
Owner SHENZHEN CHENGGONG CHEM