Metal-coated polyimide film and process for producing the same

A technology of polyimide film and manufacturing method, which is applied in metal material coating process, semiconductor/solid-state device manufacturing, sputtering coating, etc. Complicated, copper layer defects and other problems, to achieve the effect of excellent dimensional stability, fewer pores, and high folding resistance

Active Publication Date: 2011-03-30
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, if you want to apply this method of preventing the contact of the belt-shaped member and the turning roller by the release paper in the method for manufacturing a metal-clad polyimide film, you must have a mechanism for sandwiching the release paper, which not only complicates the device, but also Defects may also occur in the copper layer due to impurities generated by the release paper itself
In addition, when using a special component such as release paper, there is a problem of cost increase
[0012] Therefore, a method for reducing the number of pores of metal-clad polyimide films has not been provided

Method used

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  • Metal-coated polyimide film and process for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] Hereinafter, it demonstrates step by step.

[0095] 1. Formation of the underlying metal layer (step (a))

[0096] The polyimide film is continuously conveyed by an unwinding machine and a coiling machine, and a nickel-chromium alloy layer with a thickness of 23nm is formed by a common DC sputtering method. The chromium concentration of the nickel-chromium layer was 20% by mass.

[0097] Next, a copper layer with a thickness of 100 nm was formed thereon to obtain an underlying metal layer.

[0098] In addition, the device used to form the underlying metal layer is a device that is equipped with an unwinder, a coiler, and a sputtering device in a vacuum chamber. After the nickel-chromium layer is formed, only the side of the polyimide film is supported by a conveying roller. The coiler coils onto rolls.

[0099] The results of observing the polyimide film with the underlying metal layer through a light-transmitting observation platform are shown in Table 1.

[0100] ...

Embodiment 2

[0104] Except using a polyimide film with a thickness of 35 μm (manufactured by Kaneka Co., Ltd., Apical-35FP) as the polyimide film, a metal-clad polyimide film was obtained in the same manner as in Example 1, and evaluated in the same manner as in Example 1. . The obtained results are shown in Table 1.

[0105] In addition, the internal stress of the plated film is formed by laminating the film formed by the cell method in the state before the polyimide film is dried, thereby forming a tensile stress corresponding to a range of 5 to 30 MPa.

Embodiment 3

[0107] A metal-clad polyimide film was obtained in the same manner as in Example 1 except that the thickness of the copper plating layer was 0.5 μm, and it was evaluated in the same manner as in Example 1. The obtained results are shown in Table 1.

[0108] In addition, the internal stress of the plated film is equivalent to a tensile stress in the range of 5 to 30 MPa when the film formed by the cell method is stacked in the state before the polyimide film is dried.

[0109] When the previous test piece was measured, the internal stress of the plated film was a tensile stress of 8 MPa in the state before the polyimide film was dried.

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Abstract

The present invention relates to a metal-coated polyimide film and a process for producing the same. The objective of the invention is to provide the metal-coated polyimide film and the process for producing the same, having high folding resistance and excellent dimension stability corresponding to fine space between and less air hole number of an electronic circuit. To this end, the surface of the polyimide film is provided with a base metal layer composed of a nickel-chromium alloy layer and a copper layer by a dry-type electroplating method in a continuous coiling manner, when the surface of the polyimide film is provided with a copper electroplating layer, during a period from setting the nickel-chromium alloy layer on the surface of the polyimide film to coil the polyimide film provided with the base metal layer to a roller, a part contacted with a conveying device for conveying is only used as the surface of the polyimide film.

Description

technical field [0001] The invention relates to a metal-clad polyimide film and a manufacturing method thereof. In more detail, it relates to a metal-clad polyimide film and a manufacturing method thereof, which can meet the requirements of electronic circuits with a fine pitch, a very small number of pores, high folding resistance, and excellent dimensional stability. Background technique [0002] Metal-clad polyimide films are widely used as packaging substrates for driving IC substrates that display images on liquid crystal screens. In recent years, COF (chip on film) has attracted attention as a method of encapsulating IC substrates for driving ICs for liquid crystal display. [0003] Compared with the current mainstream packaging method TCP (Tape Carrier Package), COF has the following characteristics: the wiring can be finer, and the IC substrate for driving the package can be miniaturized, and the packaging cost can be easily reduced. [0004] As a general productio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/498
CPCH01L2924/0002H01L2924/00C23C14/20C23C14/56C25D3/38C25D5/56
Inventor 曾根博文小笠原修一
Owner SUMITOMO METAL MINING CO LTD
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