On-machine calibration method for grinding dynamometer and horizontal force loader

A calibration method and the technology of a dynamometer, applied in the field of sensor testing, to achieve good measurement performance

Inactive Publication Date: 2011-05-04
DALIAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the grinding dynamometer has been calibrated statically and dynamically during assembly and debugging, when the grinding dynamometer is installed on the grinding machine, due to changes in the use conditions and environment, it must be used accor

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  • On-machine calibration method for grinding dynamometer and horizontal force loader
  • On-machine calibration method for grinding dynamometer and horizontal force loader
  • On-machine calibration method for grinding dynamometer and horizontal force loader

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Embodiment Construction

[0015] The specific implementation of the present invention is described in detail in combination with the accompanying drawings and technical solutions. The present invention takes the grinding dynamometer as an example of on-machine calibration. Before the dynamometer is formally connected, each component link must be checked one by one to prevent it from being Short circuit, open circuit, especially excessive zero drift. Check whether the low-noise cable connected between the dynamometer and the charge amplifier is short-circuited, open-circuited, and whether the insulation resistance between electrodes is ≥10 13 Ω, otherwise it needs to be cleaned and dried; after the charge amplifier is warmed up for 30 minutes, connect it to the monitoring software to check its no-load zero drift situation. If it exceeds the specified index (3mv / min) of the dynamometer, the input End sockets should be cleaned and dried. The above instruments and wires can be connected and debugged only ...

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Abstract

The invention discloses an on-machine calibration method for a grinding dynamometer and a horizontal force loader, and belongs to the technical field of sensing test. In the method, the grinding dynamometer is connected with a charge amplifier, a data acquisition card and an industrial personal computer in turn to form a measurement and control system. After the grinding dynamometer is arranged on a grinding machine, a standard load is applied to the grinding dynamometer, the grinding dynamometer is subjected to normalized regulation, and the normalized sensitivity of the grinding dynamometer in each direction is determined; and after the monitoring software installed in the industrial personal computer process the data, a 'force value-indicating value' on-machine calibration curve of the grinding dynamometer is established, and then each performance index is solved. Two horizontal force loaders with totally same structures and the standard dynamometer are adopted in the on-machine calibration method to measure an axial force Fz, a radial force Fr and a tangential force Ft generated when a silicon wafer is ground; and each horizontal force loader consists of a mobile sleeve, a lifting screw, an end connecting plate, a screw, a connecting shaft, a speed reducer, a horizontal guide sleeve and the like. The method is simple and convenient, has low interference, and can achieve good measurement performance.

Description

technical field [0001] The on-machine calibration method of a grinding dynamometer and a horizontal force loader of the invention belong to the technical field of sensor testing. Background technique [0002] In the grinding process, the grinding force comprehensively reflects the influence of factors such as the nature and condition of the workpiece material, the characteristics of the grinding wheel and the wear state, the processing amount and the parameters of the process system on the grinding process. Precision, surface quality and subsurface damage are directly related. Especially in the ultra-precision grinding process of large and thin hard and brittle semiconductor crystal silicon wafers, the change and fluctuation of the grinding force will affect the quality and deformation of the grinding surface of the silicon wafer, and even cause the substrate to break. Therefore, real-time measurement and control of grinding force during the grinding process is a necessary ...

Claims

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Application Information

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IPC IPC(8): B24B49/00
Inventor 钱敏张军刘博康仁科郭东明
Owner DALIAN UNIV OF TECH
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