Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus

Abstract

The invention provides a semiconductor device, a flip-chip mounting method and a flip-chip mounting apparatus. A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) between the semiconductor chip (1) and the circuit board (4). A container covering the semiconductor chip (1) is bonded on the circuit board (4). At this time, the semiconductor chip (1), which is positioned so that the underfill resin (6) is between the circuit board (4) and the semiconductor chip (1), is press heated by a pressure-bonding tool (8). When doing this, the surface of the protruding underfill resin (6) at the periphery of the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13), which has a periodically repeating pattern of surface relief, so as to form a surface relief (16a). Then, the inner surface of the container covering the semiconductor chip (1) and the surface relief (16a) of the underfill resin surface are bonded to each other.

Description

technical field [0001] The present invention relates to a semiconductor device and a flip chip mounting method. Background technique [0002] In recent years, a semiconductor device in which a bare (bare: bare) semiconductor chip is directly mounted on a wiring board (bare chip mounting) has been demanded due to demands for smaller and thinner electronic equipment. In particular, there is a demand for a semiconductor device in which a circuit surface of a semiconductor chip is mounted upside down (flip chip mounting) on ​​a wiring board so as to face it. [0003] Conventionally, flip-chip semiconductor devices such as Figure 45 As shown, a semiconductor chip 51 including internal connection terminals such as metal bump electrodes is mounted on a wiring substrate 50 by flip-chip connection. 52 is an anisotropic conductive adhesive. [0004] In this semiconductor device, when an external force acts on the semiconductor chip 51 , the anisotropic conductive adhesive 52 is dam...

AI Technical Summary

Problems solved by technology

[0009] In the flip-chip mounting method of Patent Document 1, since the process of heating the anisotropic conductive adhesive 52 is controlled so that the unevenness 53 is formed on the chamfer, the unevenness is gentle and the shape varies.

[0010] In addition, in a high-temperature and high-humidity environment, moisture is likely to intrude into the electrical connection between the wiring substrate 50 and the semiconductor chip 51, resulting in low reliability.

[0011] Therefore, while thinking of passing in Figure 46 The container is integrally formed on the component formed in the patent document 2, or a plurality of holes are formed on the surface of the molded resin by using Patent Document 2, and the container is further integrally formed on it, so that a semiconductor with higher mechanical strength and electrical connection reliability can be obtained than before. device, but in any case, it is impossible to form shape-stable unevenness on the surface before forming the container, so the container is easy to come off and the mechanical strength cannot be improved

Images