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Halogen-free flame-retardant epoxy resin composition and application thereof

A technology of epoxy resin and epoxy resin solution, which is applied in the direction of layered products, metal layered products, circuit substrate materials, etc., and can solve the problems of hard and brittle halogen-free phosphorus-containing flame-retardant resins, insufficient heat resistance, and high water absorption and other problems, to achieve the effect of good flame retardancy, low water absorption and excellent flame retardancy

Active Publication Date: 2011-05-11
EPOXY BASE ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, all halogen-free and phosphorus-containing flame-retardant resins have defects such as hardness and brittleness, high water absorption rate, and insufficient heat resistance, which greatly restrict their application.

Method used

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  • Halogen-free flame-retardant epoxy resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Preparation of phosphorus-containing epoxy resin butanone solution:

[0025] Add 27 parts by weight of novolac epoxy resin and 12 parts by weight of reactive phosphorus-containing compound into the reaction tank, add 0.012 parts by weight of catalyst triphenylphosphine at 120 ° C, react at 175 ° C for 2.5 hours, and then mix in 7 parts by weight of low molecular weight Bisphenol A type epoxy resin, 7 parts by weight of high molecular weight bisphenol A type epoxy resin and 3.7 parts by weight of tetraphenol ethane tetraglycidyl ether are dissolved with methyl ethyl ketone to form a solution with a solid content of 75%. The above-mentioned consumptions are all parts by weight.

[0026] (2) Preparation of halogen-free flame retardant epoxy resin composition:

[0027] Weigh the phosphorus-containing epoxy resin methyl ethyl ketone solution obtained in step (1) and curing agents such as benzoxazine and diaminodiphenyl sulfone, add inorganic fillers and curing accelerat...

Embodiment 2

[0036] (1) Preparation of phosphorus-containing epoxy resin butanone solution:

[0037] Add 27 parts by weight of novolac epoxy resin and 12 parts by weight of reactive phosphorus-containing compound into the reaction tank, add 0.012 parts by weight of catalyst triphenylphosphine at 120 ° C, react at 175 ° C for 2.5 hours, and then mix in 7 parts by weight of low molecular weight Bisphenol A type epoxy resin, 7 parts by weight of high molecular weight bisphenol A type epoxy resin and 3.7 parts by weight of tetraphenol ethane tetraglycidyl ether are dissolved with methyl ethyl ketone to form a solution with a solid content of 75%. The above-mentioned consumptions are all parts by weight.

[0038] (2) Preparation of halogen-free flame retardant epoxy resin composition:

[0039] Weigh the phosphorus-containing epoxy resin methyl ethyl ketone solution obtained in step (1) and curing agents such as benzoxazine and diaminodiphenyl sulfone, add inorganic fillers and curing accelerat...

Embodiment 3

[0048] (1) Preparation of phosphorus-containing epoxy resin butanone solution:

[0049]Add 27 parts by weight of novolac epoxy resin and 12 parts by weight of reactive phosphorus-containing compound into the reaction tank, add 0.012 parts by weight of catalyst triphenylphosphine at 120 ° C, react at 175 ° C for 2.5 hours, and then mix in 7 parts by weight of low molecular weight Bisphenol A type epoxy resin, 7 parts by weight of high molecular weight bisphenol A type epoxy resin and 3.7 parts by weight of tetraphenol ethane tetraglycidyl ether are dissolved with methyl ethyl ketone to form a solution with a solid content of 75%. The above-mentioned consumptions are all parts by weight.

[0050] (2) Preparation of halogen-free flame retardant epoxy resin composition:

[0051] Weigh the phosphorus-containing epoxy resin methyl ethyl ketone solution obtained in step (1) and curing agents such as benzoxazine and diaminodiphenyl sulfone, add inorganic fillers and curing accelerato...

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Abstract

The invention discloses a halogen-free flame-retardant epoxy resin composition comprising the following components in parts by weight: 40-70 parts by weight of phosphor-containing epoxy resin solution, 25-50 parts by weight of benzoxazine, 5-40 parts by weight of diamino diphenyl sulfone, 0.1-0.8 part by weight of curing accelerator and 20-200 parts by weight of filler. The epoxy resin composition disclosed by the invention has the advantages of favorable operability, favorable flame-retardant performance, excellent reactivity and the like and is used for preparing a printed circuit copper clad laminate, so that the copper clad laminate has the comprehensive performances of favorable heat resistance, excellent flame-retardant performance, low water absorption rate and the like.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to a halogen-free flame-retardant epoxy resin composition for printed circuit copper-clad boards. Background technique [0002] Due to the needs of environmental protection, from July 1, 2006, the global electronics industry has entered the era of lead-free soldering. Due to the increase of lead-free soldering temperature, the heat resistance, flame retardancy and thermal stability of printed circuit copper clad laminates put forward higher requirements. The original component soldering process is replaced by lead-free soldering process, and the soldering temperature is 20°C higher than before, which puts forward higher requirements for the comprehensive performance of printed circuit boards and substrates, such as: flame retardancy, excellent Heat resistance, low water absorption, therefore, the halogen-free flame retardant copper clad laminate is imminent for domestic copper clad lam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08L63/02C08G59/56B32B15/092H05K1/03
Inventor 黄活阳林仁宗吴永光
Owner EPOXY BASE ELECTRONICS MATERIAL
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