Assembling structure of diode of rectifier and heat-radiating plate for automotive
A technology for automotive rectifiers and assembly structures, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device parts, etc., can solve the problems of complex sintering process, influence of diode chips, and high chip damage rate, so as to shorten working hours and reduce The effect of scrap rate and improvement of production efficiency
Inactive Publication Date: 2011-05-18
阚勇
View PDF0 Cites 4 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the high temperature and stress during sintering will affect the diode chip. After sintering, the chip damage rate is as high as 40%, and it must be reworked.
At the same time, the melting point of the solder paste is too low, and the rectifier will generate high temperature during operation, which will easily cause the sintered solder paste to melt, causing the product to fail suddenly and causing serious consequences to the customer terminal
This sintering method is complicated. It is necessary to apply solder paste on the fixed position of the heat sink first, then place the diode on the solder paste, and fix the position of the diode with a sintering fixture to prevent the diode from moving when the solder paste melts, and then put it into the tunnel for sintering. Furnace for sintering, this sintering process takes 15-20 minutes
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0009] With reference to the accompanying drawings, the present invention includes that the heat dissipation plate (2) of the rectifier is made of die-cast aluminum, and the heat dissipation plate (2) is provided with through holes required for press fitting. The diode (1) adopts a copper base structure with straight lines on the circumferential surface. The diode (1) and the cooling plate (2) are press-fitted together through the through hole.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more PUM
Login to view more Abstract
The invention discloses an assembling structure of a diode of a rectifier and a heat-radiating plate for an automotive, comprising the diode and the heat-radiating plate. The assembling structure is characterized in that the heat-radiating plate is provided with a through hole needed by press mounting; the diode adopts a copper base structure with a circumferential surface provided with straight lines; and the diode and the heat-radiating plate are pressed and mounted together in an interference way through the through hole. The invention has the advantages of effectively simplifying the process, reducing the defective index, also enhancing the heat-radiating effect of products and enhancing the reliability of the products.
Description
technical field [0001] The invention relates to an assembly method of an automobile rectifier diode and a heat dissipation plate of the automobile rectifier, in particular to an assembly structure of an automobile rectifier diode and a heat dissipation plate. Background technique [0002] The current VALEO series of dual-group automotive rectifiers are assembled with diodes and heat sinks by integral sintering, which is a complex production process with high costs and long working hours. This type of assembly requires the diode to be sintered to the heat sink. However, the high temperature and stress during sintering will affect the diode chip. After sintering, the damage rate of the chip is as high as 40%, and it must be reworked. At the same time, the melting point of the solder paste is too low, and the rectifier will generate high temperature during operation, which will easily cause the sintered solder paste to melt, causing the product to suddenly fail, causing seriou...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more Application Information
Patent Timeline
Login to view more Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/40H01L23/367H02M7/02
Inventor 阚勇
Owner 阚勇
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Try Eureka
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap