Assembling structure of diode of rectifier and heat-radiating plate for automotive
A technology for automotive rectifiers and assembly structures, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device parts, etc., can solve the problems of complex sintering process, influence of diode chips, and high chip damage rate, so as to shorten working hours and reduce The effect of scrap rate and improvement of production efficiency
A technology for automotive rectifiers and assembly structures, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device parts, etc., can solve the problems of complex sintering process, influence of diode chips, and high chip damage rate, so as to shorten working hours and reduce The effect of scrap rate and improvement of production efficiency
CN102064147AInactive Publication Date: 2011-05-18阚勇
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[0009] With reference to the accompanying drawings, the present invention includes that the heat dissipation plate (2) of the rectifier is made of die-cast aluminum, and the heat dissipation plate (2) is provided with through holes required for press fitting. The diode (1) adopts a copper base structure with straight lines on the circumferential surface. The diode (1) and the cooling plate (2) are press-fitted together through the through hole.
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The invention discloses an assembling structure of a diode of a rectifier and a heat-radiating plate for an automotive, comprising the diode and the heat-radiating plate. The assembling structure is characterized in that the heat-radiating plate is provided with a through hole needed by press mounting; the diode adopts a copper base structure with a circumferential surface provided with straight lines; and the diode and the heat-radiating plate are pressed and mounted together in an interference way through the through hole. The invention has the advantages of effectively simplifying the process, reducing the defective index, also enhancing the heat-radiating effect of products and enhancing the reliability of the products.
Description
technical field [0001] The invention relates to an assembly method of an automobile rectifier diode and a heat dissipation plate of the automobile rectifier, in particular to an assembly structure of an automobile rectifier diode and a heat dissipation plate. Background technique [0002] The current VALEO series of dual-group automotive rectifiers are assembled with diodes and heat sinks by integral sintering, which is a complex production process with high costs and long working hours. This type of assembly requires the diode to be sintered to the heat sink. However, the high temperature and stress during sintering will affect the diode chip. After sintering, the damage rate of the chip is as high as 40%, and it must be reworked. At the same time, the melting point of the solder paste is too low, and the rectifier will generate high temperature during operation, which will easily cause the sintered solder paste to melt, causing the product to suddenly fail, causing seriou...
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Patent Timeline
18 May 2011
Publication
CN102064147A
- IPC
- H01L23/40; H01L23/367; H02M7/02
- Inventors
- 阚勇