Electro-thermal coating
A technology of electrothermal coatings and pigments and fillers, which is applied in the direction of conductive coatings, epoxy resin coatings, coatings, etc., can solve the problems of low heating efficiency, unfavorable practical application, and poor coating adhesion, so as to improve electrical conductivity and good Heat generation effect, cost reduction effect
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Embodiment 1
[0008] The present invention includes the following materials in parts by weight: 40 parts of film-forming substances, 22.5 parts of pigments and fillers, 1 part of additives, and 25 parts of solvents. Coatings in the range 45 μm.
[0009] The film-forming material is acrylic resin, epoxy resin or polyurethane resin; pigments and fillers include 5 parts of Ni powder and 20 parts of silver-coated copper powder, which contain 20% silver by weight; additives include adhesion promoter Silok629, the content Accounting for 0.75% of the film-forming substance, and dispersant Efka4010, the content accounts for 0.75% of the pigment; the diluent corresponding to the acrylic resin includes the following volume ratio materials: butyl acetate 20: xylene 60: cyclohexanone 20; epoxy resin corresponding The diluent includes materials in the following volume ratio: butyl acetate 40: methyl ethyl ketone 40: cyclohexanone 20; the diluent corresponding to the polyurethane resin includes materials...
Embodiment 2
[0011] The present invention includes the following materials in parts by weight: 60 parts of film-forming substances, 30 parts of pigments and fillers, 2 parts of additives, and 30 parts of solvents. Coatings in the range 30 μm.
[0012] The film-forming material is acrylic resin, epoxy resin or polyurethane resin; pigments and fillers include 15 parts of Ni powder, 10 parts of silver-coated copper powder, which contains 30% silver by weight; additives include adhesion promoter Silok629, the content Accounting for 1% of the film-forming substance, and dispersant Efka4010, the content accounts for 0.5% of the pigment; the diluent corresponding to the acrylic resin includes the following volume ratio materials: butyl acetate 20: xylene 60: cyclohexanone 20; epoxy resin The corresponding diluent includes materials in the following volume ratio: butyl acetate 40: methyl ethyl ketone 40: cyclohexanone 20; the corresponding diluent of polyurethane resin includes materials in the fo...
Embodiment 3
[0014] The present invention includes the following materials in parts by weight: 50 parts of film-forming substances, 15 parts of pigments and fillers, 1.5 parts of additives, and 20 parts of solvents. Coatings in the range 60 μm.
[0015] The film-forming material is acrylic resin, epoxy resin or polyurethane resin; pigments and fillers include 10 parts of Ni powder and 15 parts of silver-coated copper powder, which contain 10% silver by weight; additives include adhesion promoter Silok629, the content Accounting for 0.5% of the film-forming substance, and dispersant Efka4010, the content accounts for 1% of the pigment; the diluent corresponding to the acrylic resin includes the following volume ratio materials: butyl acetate 20: xylene 60: cyclohexanone 20; epoxy resin corresponding The diluent includes materials in the following volume ratio: butyl acetate 40: butanone 40: cyclohexanone 20; the diluent corresponding to the polyurethane resin includes materials in the follo...
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