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Epoxy resin composition and application thereof

A technology of epoxy resin and composition, applied in the direction of electrical components, circuits, electrical solid devices, etc., can solve the problems of not meeting the requirements of environmental protection, difficult to meet the requirements of lead-free reflow soldering, high voltage electrical performance requirements, etc., to achieve low stress, The effect of high reliability performance and good fluidity

Active Publication Date: 2011-06-29
HENKEL HUAWEI ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the need to add bromine or antimony flame retardants in the traditional epoxy resin composition so as not to meet the environmental protection requirements; In order to have a considerable flame retardant effect, it is difficult to meet the defects of lead-free reflow soldering requirements and high-voltage electrical performance requirements, thus providing a green environmental protection, high-reliability performance and excellent high-voltage performance that can meet the lead-free high-temperature reflow process. Electrical Properties of Epoxy Resin Compositions

Method used

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  • Epoxy resin composition and application thereof
  • Epoxy resin composition and application thereof
  • Epoxy resin composition and application thereof

Examples

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Effect test

Embodiment 1

[0042] The formulation of the epoxy resin composition is shown in Table 1. Wherein, in formula I, n=10, and the equivalent ratio of novolak resin to epoxy resin is 1.08.

[0043] The preparation method of the epoxy resin composition is as follows: knead the formula in Table 1 on a twin-screw extruder at 100° C., then cool and pulverize.

Embodiment 2

[0045] The formulation of the epoxy resin composition is shown in Table 1. Wherein, n=12 in formula I, m=10 in formula II, and the equivalent ratio of novolak resin to epoxy resin is 0.89.

[0046] The preparation method of the epoxy resin composition is as follows: knead the formula in Table 1 on a twin-screw extruder at 100° C., then cool and pulverize.

Embodiment 3

[0048] The formulation of the epoxy resin composition is shown in Table 1. Wherein, n=15 in formula I, 1=10 in formula III, and the equivalent ratio of novolak resin to epoxy resin is 0.91.

[0049] The preparation method of the epoxy resin composition is as follows: knead the formula in Table 1 on a twin-screw extruder at 100° C., then cool and pulverize.

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Abstract

The invention provides an epoxy resin composition which comprises an epoxy resin mixture, a phenolic resin, a curing accelerator, an inorganic filling material, a release agent and a coupling agent, wherein the epoxy resin mixture at least comprises an epoxy resin shown in a formula I; and in the formula I, R1 and R2 independently are hydrogen or C1-C4 alkyl, and n is an integral within a range of 0-50. According to the invention, the defects that the traditional epoxy resin composition is not environment-friendly, and the requirements of semi-conductor packaging has less possibility of being met caused by adding a large amount of environmental-friendly fire retardants in the existing epoxy resin composition are overcome, thus the epoxy resin composition which has the advantages of environmental friendliness, good high-temperature reliability, high piezoelectric property and good molding formability is provided. The invention also provides application of the epoxy resin composition in green packaging of various surface mounted devices (SMDs), especially in environmental-friendly packaging of a high piezoelectric SMD. The formula I is shown in the specification.

Description

technical field [0001] The invention relates to an epoxy resin composition and its application. Background technique [0002] As a semiconductor encapsulation material, the flame retardant performance of the epoxy resin composition must meet the quality standard of UL-94V-0 flame retardant. In the existing technology, the main method to achieve this quality standard is to add a certain amount of flame retardants. There are many types of flame retardants used at present. The traditional (non-environmental) mainly uses brominated flame retardants and antimony-based flame retardants. Fuel. However, with the strengthening of global environmental protection awareness, countries have drafted environmental protection laws to restrict the use of bromide-containing flame retardants and lead-containing and other harmful substances in electronic products. As early as the early 1990s, the United States, Europe, Japan and other countries realized that with the rapid development of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08K13/02C08G59/20H01L23/29
CPCC08G59/3218C08L63/00C08G59/621C08L2666/22
Inventor 谢广超杜新宇张成中成兴明韩江龙
Owner HENKEL HUAWEI ELECTRONICS
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