Anticorrosive cleaning solution for metal

Abstract

The invention discloses a novel anticorrosive cleaning solution for metal. The cleaning solution contains at least one polymeric surfactant with a star structure, water, and a metal complexant. The cleaning solution of the invention can increase cleaning efficiency, improve surface quality, prevent the corrosion of metal materials, and significantly reduce defects.

Description

technical field [0001] The invention relates to an anti-corrosion cleaning solution for metal. Background technique [0002] Typical cleaning liquids in the prior art are mainly deionized water, hydrogen peroxide solution, dilute ammonia water, etc., and these cleaning liquids are mainly used for cleaning the residual liquid in the preceding process. The pre-order process is, for example: 1) chemical mechanical polishing process, a small amount of polishing liquid will remain on the metal surface after chemical mechanical polishing; ; 3) deposition process and other processes and so on. After the residual liquid is cleaned, the corrosion on the metal surface still exists. Corrosion on the metal surface affects the flatness of the metal surface and also keeps defect levels high, reducing product yield and yield. [0003] Some cleaning solutions have been disclosed, such as US2004 / 0204329, US2003 / 0216270, US2004 / 0082180, US6147002, US6443814, US6719614, US6767409, US6482749...

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Problems solved by technology

However, the cleaning solution in the above-mentioned patent either contains toxic substances and is not friendly to the environment; or the cleaning efficiency is not high enough; or the cleaning application range is narrow, for example, the cleaning solution of the US6443814 patent can only clean wafers containing copper metal layers

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