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Secondary leveling process for dip plasticizing of snap ring

A secondary flow and circlip technology, which is applied in the direction of pretreatment surface, coating, and surface coating liquid device, etc., can solve the problem of reducing the bonding fastness between the plastic film and the circlip base, reducing the compactness of the plastic film, reducing the Issues such as mechanical strength and weather resistance

Active Publication Date: 2013-03-20
北京盛思科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Although the process method of the invention patent application is applied in the dipping process, for the circlip working in a humid environment with large temperature changes, it needs to have higher quality requirements for corrosion resistance
The circlip products impregnated under the general one-time dipping and leveling process conditions cannot fully guarantee the firmness, uniformity, weather resistance and appearance quality of the bond between the plastic film and the circlip base
When the pre-baking temperature of the circlip is high, the bonding fastness between the plastic film and the circlip can be correspondingly improved, and at the same time, the excessively high temperature can also degrade the plastic film material, causing the plastic film to break and the plastic film to produce air bubbles , coking, over-thickness or sagging, etc., which reduce the mechanical strength and weather resistance; when the pre-baking temperature of the circlip is low, the bonding fastness between the plastic film and the circlip base is also reduced, and the plastic film itself is reduced. Density, and in the leveling stage, the thickness of the plastic film cannot be guaranteed to be consistent, and the surface is smooth and flat, which reduces the weather resistance, service life and appearance quality of the product

Method used

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  • Secondary leveling process for dip plasticizing of snap ring
  • Secondary leveling process for dip plasticizing of snap ring
  • Secondary leveling process for dip plasticizing of snap ring

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Embodiment Construction

[0029] The following is a further description of the specific implementation of the invention of the second leveling process of dipping the circlip in conjunction with the drawings of the description.

[0030] image 3 It is a schematic diagram of the shape of the circlip of the present invention, which is a serpentine curved device made of steel wire with a diameter of about 2 mm, and the thickness of the plastic-impregnated plastic layer is required to be about 0.4 mm to 0.5 mm. Due to the elasticity of the clip spring, the greenhouse film is fixed in the greenhouse film slot during use, so that the film and the greenhouse structure are fixed to realize heat preservation of the greenhouse. When the circlip works in an environment that is easily corroded, in order to prevent corrosion, it is necessary to form a firm plastic film on its surface. The technical requirements of the plastic film should be: firm combination with the circlip base, uniform thickness, surface Flat an...

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Abstract

The invention relates to a secondary leveling process for dip plasticizing of a snap ring, in particular to a secondary leveling process for dip plasticizing of a snap ring for a green house film, belonging to the technical field of methods for coating a plastic layer on metalwork. PE (polyethylene) dip plasticizing powder is used for dip plasticizing, and the secondary leveling process comprises 8 steps of: pretreatment for dip plasticizing, preliminary drying, dip plasticizing, removal of surplus dip plasticizing powder, primary heating for leveling plasticizing, secondary heating for leveling plasticizing, cooling and finished product. The secondary leveling process has double heating, plasticizing and leveling procedures, the secondary heating and plasticizing temperature is higher than the primary heating and plasticizing temperature, and is higher than the initial temperature of the snap ring entering the secondary heating and plasticizing procedure. The secondary leveling process solves the problems of small heat capacity and unstable product quality of the snap ring, and leveling and plasticizing are complete, thus improving the dip plasticizing adhesive force of the snap ring and the compactness and flatness of the plastic film.

Description

technical field [0001] The invention relates to the technical field of a method for coating a plastic layer on a metal part, in particular to a secondary leveling process for dipping a greenhouse film circlip. Background technique [0002] In facility agriculture, the solid film structure of the plastic film greenhouse is usually fixed on the main frame of the greenhouse through a spring to fix the plastic film in the slot. Under these conditions, it is very easy to corrode and fail. In order to overcome the above-mentioned technical problems, the circlip can be used in harsh environments and needs to have a certain acid, alkali and salt resistance. Usually, the surface of the circlip is pre-treated with anti-corrosion surface treatment, such as galvanizing, dipping or galvanizing+ Dip plastic, so that a protective layer against corrosion is formed on the surface of the circlip. At present, it is a common practice to form a protective layer on the circlip, which has excell...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D5/08B05D7/14B05D1/18B05D3/02B05D3/00
Inventor 杨国威杨平
Owner 北京盛思科技有限公司