Secondary leveling process for dip plasticizing of snap ring
A secondary flow and circlip technology, which is applied in the direction of pretreatment surface, coating, and surface coating liquid device, etc., can solve the problem of reducing the bonding fastness between the plastic film and the circlip base, reducing the compactness of the plastic film, reducing the Issues such as mechanical strength and weather resistance
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[0029] The following is a further description of the specific implementation of the invention of the second leveling process of dipping the circlip in conjunction with the drawings of the description.
[0030] image 3 It is a schematic diagram of the shape of the circlip of the present invention, which is a serpentine curved device made of steel wire with a diameter of about 2 mm, and the thickness of the plastic-impregnated plastic layer is required to be about 0.4 mm to 0.5 mm. Due to the elasticity of the clip spring, the greenhouse film is fixed in the greenhouse film slot during use, so that the film and the greenhouse structure are fixed to realize heat preservation of the greenhouse. When the circlip works in an environment that is easily corroded, in order to prevent corrosion, it is necessary to form a firm plastic film on its surface. The technical requirements of the plastic film should be: firm combination with the circlip base, uniform thickness, surface Flat an...
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