Mobile semiconductor laser mould repairing system

Abstract

The invention discloses a high-efficiency flexible laser repairing system for a mould in a complicated shape. The system integrates a high-power semiconductor laser device, 6-axis full-joint type industrial robot, an optical fiber light guiding system and the like. According to the invention, as a semiconductor laser device with small volume and light weight and a movably-mounted industrial robot are adopted, the movement of the entire system can be realized conveniently so as to realize field repair of the mould. The invention provides a method for integrating the semiconductor laser device, the industrial robot, a laser working head and the like, and the method comprises the following steps: transmitting semiconductor laser through the optical fiber light guiding system which has good flexibility and is flexible and convenient; after the semiconductor laser reaches the laser working head held in the wrist of the industrial robot, collimating and focusing the semiconductor laser and irradiating the damaged part; and meanwhile, heating the powder and workpiece surface material, and cladding the repaired part layer by layer under the program control to realize repair of the damaged part. According to the invention, the field processing of large and ultra-large moulds or parts which are inconvenient to move can be realized, and the system disclosed by the invention is particularly suitable for flexible production of multiple varieties and batches.

Description

technical field [0001] The invention relates to equipment for repairing and maintaining damaged parts, in particular to equipment for repairing large molds on site. Background technique [0002] Currently available repair techniques include electroplating, arc or flame surfacing, thermal spraying (flame, plasma), etc. The electroplating layer is generally very thin, no more than 0.03mm, and it is poorly bonded to the substrate, and it is difficult to repair the damaged part of the shape; during surfacing welding, thermal spraying or spray welding, the heat injection is large, the energy is not concentrated, the heat affected area of ​​the mold is large, and it is easy to be deformed Even cracking, the dilution rate of the sprayed layer is large, which reduces the performance of the matrix and the material, and the combination of the repaired part and the matrix of the part is difficult to meet the requirements of the original part. Compared with the existing repair technolo...

AI Technical Summary

Problems solved by technology

[0005] The technical solution adopted by the patent of this invention to solve its technical problems is: Aiming at the shortcomings of the current laser repair device, which are bulky and inconvenient to move, this patent has invented a mobile semiconductor laser mold surface repair system, which is characterized by high Integration of power semiconductor lasers, 6-axis fully articulated robots and coaxial powder nozzles

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