Metalized polyimide film and flexible circuit board with the same
A technology of polyimide film and flexible circuit board, applied in the direction of circuit substrate materials, metal layered products, printed circuit components, etc., to achieve the effect of high industrial value
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Embodiment 1
[0120] First, prepare a water absorption rate of 1.8% by mass, a coefficient of thermal expansion of 5 ppm / °C in the TD direction, and 11 ppm / °C in the MD direction, and as figure 1 The thin film X-ray diffraction results shown in , it can be clearly seen that when 2θ is 14°, 29°, and 44°, there are peaks with a half-maximum width of 1.0° or less, respectively, and a long film with a thickness of 38 μm mainly composed of biphenyltetracarboxylic acid. A strip of polyimide film (Toray Dupont, KAPTON 150EN-A). Its humidity expansion coefficient is 11ppm / %HR in the TD direction and 12ppm / %HR in the MD direction.
[0121] On one side of the polyimide film, the average thickness is formed by the DC sputtering method using a sputtering device consisting of an unwinder, a sputtering device, and a coiler. A chromium-nickel alloy layer having 7% by mass of Cr was used as the metal thin film. In addition, the average thickness is also formed on the underlying metal film copper film....
Embodiment 2
[0126] First, the water absorption rate is 1.7% by mass, the coefficient of thermal expansion is 5ppm / °C in the TD direction, and 13ppm / °C in the MD direction, and the results of X-ray diffraction of the film show that the 2θ is 14°, 29°, and 44°. A long polyimide film (Toray Dupont, KAPTON 150EN-A) with a peak height and width below 1.0° and a thickness of 38 μm, mainly composed of biphenyltetracarboxylic acid. Its humidity expansion coefficient is 9ppm / %HR in the TD direction and 14ppm / %HR in the MD direction.
[0127] On one side of the polyimide film, the average thickness is formed by the DC sputtering method using a sputtering device consisting of a unwinder, a sputtering device, and a coiler. A chromium-nickel alloy layer having 20% by mass of Cr was used as the metal thin film. In addition, the average thickness is also formed on the metal film copper film.
[0128]Then, on the copper film, a copper film with a thickness of 8 μm was provided by a copper electrop...
Embodiment 3
[0134] First, the water absorption rate is 1.6% by mass, the coefficient of thermal expansion is 5ppm / °C in the TD direction, and 15ppm / °C in the MD direction, and the results of X-ray diffraction of the film show that the 2θ is 14°, 29°, and 44°. A long polyimide film (Toray Dupont, KAPTON 150EN-A) with a peak height and width of 1.0° or less, a thickness of 38 μm, and biphenyltetracarboxylic acid as the main component. Its humidity expansion coefficient is 13ppm / %HR in the TD direction and 15ppm / %HR in the MD direction.
[0135] Next, on one side of the polyimide film, an average thickness of A chromium-nickel alloy layer having 20% by mass of Cr was used as the metal thin film. In addition, the average thickness is also formed on the underlying metal film copper film.
[0136] Then, on the copper film, a copper film with a thickness of 1 μm was provided by a copper electroplating method to obtain a metallized polyimide film. The electroplating bath used was a copper...
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