Welding method for target and back plate

A welding method and target material technology, which is applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of slow heating rate and difficulty in mass production of target components, so as to improve production efficiency and realize The effect of mass production

Inactive Publication Date: 2011-07-27
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the prior art, a heating plate is usually used to heat the workpiece and the solder for brazing. Since the heating plate as

Method used

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  • Welding method for target and back plate
  • Welding method for target and back plate
  • Welding method for target and back plate

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Embodiment Construction

[0030] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0031] In the following description, specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways than those described here, and those skilled in the art can make similar extensions without departing from the connotation of the present invention. Accordingly, the present invention is not limited to the specific embodiments disclosed below.

[0032] As mentioned in the background technology, in the prior art, the heating plate is used to heat the workpiece (target and back plate) and solder to complete brazing. Since the heating plate is used as the heat source, the temperature rise rate of the workpiece and solder is relatively...

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Abstract

The invention relates to a welding method for a target and a back plate, comprising the steps of: providing the target and the back plate; adding welding flux on welding surfaces of the target and the back plate, and matching the target and the back plate; putting the target and the back plate after being matched into a coil; applying current to the coil, carrying induction heating on the target and the back plate after being matched, and then welding the heated target and the heated back plate into a target component; and cooling the target component. In the welding method, fast heating can be carried out on the target and the back plate as well as the welding flux so as to finish the braze welding of the target and the back plate to form the target component, so that the production efficiency can be improved, and the large-batch production of the target component can be realized.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a welding method for a target material and a back plate. Background technique [0002] In the semiconductor industry, a target assembly is composed of a target that meets the sputtering performance and a back plate that is combined with the target and has a certain strength. The back plate can play a supporting role when the target assembly is assembled into the sputtering machine, and has the effect of conducting heat. In the manufacture of large-scale integrated circuits, aluminum targets are often used for physical vapor deposition (PVD) coating to form barrier layers. Magnetron sputtering is used for aluminum targets in the sputtering process, which usually has high strength, high thermal conductivity and high electrical conductivity. The copper material is used as the back plate material, but the aluminum target and the back plate material must be welded together ...

Claims

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Application Information

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IPC IPC(8): B23K1/002B23K1/20B23K35/26
CPCH01L21/187H01J37/00H01L21/185C23C14/3407B23K1/002B23K1/0008B23K1/16C23C14/34H01L21/203
Inventor 姚力军潘杰王学泽陈勇军
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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